电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2015年
1期
32-35
,共4页
刘晓琴%苏晓磊%刘新峰%屈银虎
劉曉琴%囌曉磊%劉新峰%屈銀虎
류효금%소효뢰%류신봉%굴은호
铜电子浆料%玻璃粉%丝网印刷%抗氧化%抗老化%导电性
銅電子漿料%玻璃粉%絲網印刷%抗氧化%抗老化%導電性
동전자장료%파리분%사망인쇄%항양화%항노화%도전성
conductive copper paste%glass powder%screen printing%anti-oxidant%anti-aging%conductive property
以铜粉、玻璃粉和有机载体为原料，采用丝网印刷将铜浆料印刷到氧化铝陶瓷基片上，制备高温烧结型铜电子浆料。通过X射线衍射仪、扫描电子显微镜、能谱仪和四探针导电性测试仪对烧结后的试样行了表征。结果表明：在氮气保护性气氛下、烧结温度为450℃、玻璃粉质量分数为8%时，铜电子浆料烧结后的铜导电膜层导电性最佳，方阻值为23.62 mΩ/□，133 d内电阻的变化率仅为28.7%，铜导电膜层光滑平整。
以銅粉、玻璃粉和有機載體為原料，採用絲網印刷將銅漿料印刷到氧化鋁陶瓷基片上，製備高溫燒結型銅電子漿料。通過X射線衍射儀、掃描電子顯微鏡、能譜儀和四探針導電性測試儀對燒結後的試樣行瞭錶徵。結果錶明：在氮氣保護性氣氛下、燒結溫度為450℃、玻璃粉質量分數為8%時，銅電子漿料燒結後的銅導電膜層導電性最佳，方阻值為23.62 mΩ/□，133 d內電阻的變化率僅為28.7%，銅導電膜層光滑平整。
이동분、파리분화유궤재체위원료，채용사망인쇄장동장료인쇄도양화려도자기편상，제비고온소결형동전자장료。통과X사선연사의、소묘전자현미경、능보의화사탐침도전성측시의대소결후적시양행료표정。결과표명：재담기보호성기분하、소결온도위450℃、파리분질량분수위8%시，동전자장료소결후적동도전막층도전성최가，방조치위23.62 mΩ/□，133 d내전조적변화솔부위28.7%，동도전막층광활평정。
High temperature sintered copper conductive pastes were printed on alumina ceramic substrate by the screen printing using copper powder, glass powder and organic vehicle as the raw materials. The samples were characterized by XRD, SEM, EDS, respectively. Results show that when the conductive copper paste is sintered with 8% (mass fraction) of glass powder at 450℃ in N2 atmosphere, the prepared conductive copper film presents smooth and plain, and shows the best conductive properties as follows: the sheet resistance is 23.62mΩ/□ and the resistance change rate is 28.7% for 133 days.
