电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2015年
1期
26-28
,共3页
铜框架%表面%氧化铜%氢氧化铜%XPS%粘接强度
銅框架%錶麵%氧化銅%氫氧化銅%XPS%粘接彊度
동광가%표면%양화동%경양화동%XPS%점접강도
copper leadframes%surface%cupric oxide%cupric hydroxide%XPS%adhesion strength
电子封装用铜框架表面采用不同温度处理，与电子封装用环氧材料复合制备用于拉伸测试的Tap pull样品。XPS分析表明，一般铜框架表面成分包括一价的氧化亚铜和二价的氢氧化铜等。175℃热处理120 min可使表面的二价氧化铜质量分数达到73%，氧化铜和表面约20%的氢氧化铜一起显著提高界面的粘接性能。
電子封裝用銅框架錶麵採用不同溫度處理，與電子封裝用環氧材料複閤製備用于拉伸測試的Tap pull樣品。XPS分析錶明，一般銅框架錶麵成分包括一價的氧化亞銅和二價的氫氧化銅等。175℃熱處理120 min可使錶麵的二價氧化銅質量分數達到73%，氧化銅和錶麵約20%的氫氧化銅一起顯著提高界麵的粘接性能。
전자봉장용동광가표면채용불동온도처리，여전자봉장용배양재료복합제비용우랍신측시적Tap pull양품。XPS분석표명，일반동광가표면성분포괄일개적양화아동화이개적경양화동등。175℃열처리120 min가사표면적이개양화동질량분수체도73%，양화동화표면약20%적경양화동일기현저제고계면적점접성능。
Copper leadframes were treated at different temperatures and then used to prepare tensile test samples with the epoxy moulding compounds (EMC). XPS analysis indicates, the surfaces of raw copper leadframes are mainly composed of cuprous oxide and cupric hydroxide. Deep thermal treatment (175℃, 120 min) can lead to a more oxidized surface, that is mainly composed of cupric hydroxide and cupric oxide with cupric oxide mass fraction of 73%.
