电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2015年
1期
22-25
,共4页
刘培生%黄金鑫%卢颖%杨龙龙
劉培生%黃金鑫%盧穎%楊龍龍
류배생%황금흠%로영%양룡룡
晶圆级封装%有限元分析%热仿真%优化分析%热阻%基板
晶圓級封裝%有限元分析%熱倣真%優化分析%熱阻%基闆
정원급봉장%유한원분석%열방진%우화분석%열조%기판
wafer level packaging%finite element analysis%thermal simulation%optimization analysis%thermal resistance%substrate
通过有限元分析软件ANSYS,对一款晶圆级封装的产品进行有限元分析仿真,讨论了空气对流系数、环境温度、基板厚度、焊球间距等因素对芯片热阻的影响。结果表明:考虑成本、散热等综合因素,选择空气对流系数为25×10–6W/(mm·℃)基板厚度为0.10 mm、焊球间距为0.5 mm为最优参数,可满足实际生产需要。
通過有限元分析軟件ANSYS,對一款晶圓級封裝的產品進行有限元分析倣真,討論瞭空氣對流繫數、環境溫度、基闆厚度、銲毬間距等因素對芯片熱阻的影響。結果錶明:攷慮成本、散熱等綜閤因素,選擇空氣對流繫數為25×10–6W/(mm·℃)基闆厚度為0.10 mm、銲毬間距為0.5 mm為最優參數,可滿足實際生產需要。
통과유한원분석연건ANSYS,대일관정원급봉장적산품진행유한원분석방진,토론료공기대류계수、배경온도、기판후도、한구간거등인소대심편열조적영향。결과표명:고필성본、산열등종합인소,선택공기대류계수위25×10–6W/(mm·℃)기판후도위0.10 mm、한구간거위0.5 mm위최우삼수,가만족실제생산수요。
The finite element analysis software ANSYS was used to analyze and simulate an IC with wafer level packaging. The effects of the air convection coefficient, the environment temperature, the substrate thickness and the distance between soldering ball on the chip thermal resistance were discussed. The simulation results show that, based on comprehensive consideration of cost and heat dissipation,etc, 25×10–6W/(mm·℃) of air convection coefficient,0.10 mm of substrate thickness and 0.5 mm of soldering ball pitch are the suitable parameters to reach optimal effect in producing.