CAJ | 학술논문

以羟基硅油、γ-（2，3-环氧丙氧）丙基三甲氧基硅烷（KH 560）、乙烯基三甲氧基硅烷等为原料，制得LED封装胶专用增粘剂。研究了增粘剂合成工艺对聚邻苯二酰胺树脂（ PPA）及金属粘接性的影响。结果表明，制备增粘剂的较佳工艺为：羟基硅油、KH 560、乙烯基三甲氧基硅烷的量之比为1.0：1.0：0.5，二月桂酸二丁基锡的质量分数为250×10-6，在温度60~65℃下保温反应4 h；将此增粘剂按LED封装胶总质量的1.25%加入到B组分中配成封装胶，用于5050、5730灯架的封装测试，过3次回流焊，然后在100℃沸腾的红墨水中连续煮18 h，红墨水不渗入灯珠内杯周边及底部。
이간기규유、γ-（2，3-배양병양）병기삼갑양기규완（KH 560）、을희기삼갑양기규완등위원료，제득LED봉장효전용증점제。연구료증점제합성공예대취린분이선알수지（ PPA）급금속점접성적영향。결과표명，제비증점제적교가공예위：간기규유、KH 560、을희기삼갑양기규완적량지비위1.0：1.0：0.5，이월계산이정기석적질량분수위250×10-6，재온도60~65℃하보온반응4 h；장차증점제안LED봉장효총질량적1.25%가입도B조분중배성봉장효，용우5050、5730등가적봉장측시，과3차회류한，연후재100℃비등적홍묵수중련속자18 h，홍묵수불삼입등주내배주변급저부。
The tackifier for LED encapsulation was prepared with hydroxyl-terminated silicone fluid,γ-(2,3-epoxypropoxy)propyltrimethoxysilane(KH 560),vinyl trimethoxy silane,etc. as the raw materials. Effects of bonding for the tackifier on polyphosphoric acid( PPA)and metal were investigated. Results show that the reaction was carried at a molar ratio of hydroxyl-terminated silicone fluid,KH560 and vinyl trimethoxy silane of 1. 0:1. 0:0. 5,at a mass fraction of dibutyltin dilaurate of 250 × 10 -6 at 130℃ for 4 hours. Then the LED encapsulating material was obtained by adding 1. 25% of the tackifier to component B. The LED encap-sulating material was tested by a 5050,5730 lamp bead bracket,and then reflowed soldering for 3 times,and cooked it in 100℃ boiling red ink for 18 hours. The red ink did not penetrate the surrounding and bottom of the lamp bead.