红外与激光工程
紅外與激光工程
홍외여격광공정
INFRARED AND LASER ENGINEERING
2014年
12期
4006-4012
,共7页
林彬%王波%柳鹏飞%张晓峰
林彬%王波%柳鵬飛%張曉峰
림빈%왕파%류붕비%장효봉
流体动压磨削%固结磨料%表面形貌建模%流体润滑
流體動壓磨削%固結磨料%錶麵形貌建模%流體潤滑
류체동압마삭%고결마료%표면형모건모%류체윤활
hydrodynamic grinding%fixed abrasive%modeling of topography%hydrodynamic lubrication
为实现确定磨盘的磨削深度控制,减少加工中不同粒度工具的更换次数从而提高加工效率,流体动压状态下的固结磨料加工工艺第一次被提出。在完成磨盘表面形貌建模的基础上,以磨盘和工件间隙中的磨削液膜为研究对象,建立了瞬态等温条件下的流体润滑方程,并利用显示有限差分算法求得数值解。计算结果表明:通过调节动压力来控制磨削深度是可行的,因为液膜动压力随磨盘最大磨削深度的减小而有明显的上升趋势,分布也趋于平坦;提高入口压力时,动压力明显增大,但也加剧了其分布的不均匀性;因为受制于磨盘表面形貌以及加工质量要求,转速对动压力的影响并不显著。
為實現確定磨盤的磨削深度控製,減少加工中不同粒度工具的更換次數從而提高加工效率,流體動壓狀態下的固結磨料加工工藝第一次被提齣。在完成磨盤錶麵形貌建模的基礎上,以磨盤和工件間隙中的磨削液膜為研究對象,建立瞭瞬態等溫條件下的流體潤滑方程,併利用顯示有限差分算法求得數值解。計算結果錶明:通過調節動壓力來控製磨削深度是可行的,因為液膜動壓力隨磨盤最大磨削深度的減小而有明顯的上升趨勢,分佈也趨于平坦;提高入口壓力時,動壓力明顯增大,但也加劇瞭其分佈的不均勻性;因為受製于磨盤錶麵形貌以及加工質量要求,轉速對動壓力的影響併不顯著。
위실현학정마반적마삭심도공제,감소가공중불동립도공구적경환차수종이제고가공효솔,류체동압상태하적고결마료가공공예제일차피제출。재완성마반표면형모건모적기출상,이마반화공건간극중적마삭액막위연구대상,건립료순태등온조건하적류체윤활방정,병이용현시유한차분산법구득수치해。계산결과표명:통과조절동압력래공제마삭심도시가행적,인위액막동압력수마반최대마삭심도적감소이유명현적상승추세,분포야추우평탄;제고입구압력시,동압력명현증대,단야가극료기분포적불균균성;인위수제우마반표면형모이급가공질량요구,전속대동압력적영향병불현저。
Mixed contact fixed abrasive processing was proposed in this paper for controlling the grinding depth of a definitive tool and decreasing the tool switches frequency for the first time. Thus the machining efficiency can be significantly improved. The transient isotherm hydrodynamic lubrication equations of the liquid membrane between the tool and workpiece were established. Then explicit difference algorithm was adopted. The numerical simulation was conducted to analyze the hydrodynamic pressure and its distribution. The feasibility of controlling the grinding depth by the liquid membrane’ s hydrodynamic pressure was confirmed by the results. Because the hydrodynamic pressure increases with decreasing maximum grinding depth and its distribution becomes flat. The hydrodynamic pressure obviously increases with the inlet pressure, while its distribution becomes uneven. The influence of the rotational speed is inconspicuous, because of the grinding tool surface topography and the processing quality demand.