CAJ | 학술논문

高密度互连（HDI）中的微盲孔技术对于印制电路板的发展是十分重要的。聚合多孔微板型的电子级氧化铜是通过碱式碳酸铜的热分解法来制备的。所得的多孔氧化铜粒度分布范围为25～88μm，溶解速率为9s，纯度达99.87%。将氧化铜用于带不溶性阳极的电镀体系中，能对铜离子浓度进行有效补充。将电子级氧化铜粉末应用于电镀铜工艺，能使高厚径比的通孔、微盲孔以及HDI板上组合的通孔与微盲孔形成高性能的铜镀层。
고밀도호련（HDI）중적미맹공기술대우인제전로판적발전시십분중요적。취합다공미판형적전자급양화동시통과감식탄산동적열분해법래제비적。소득적다공양화동립도분포범위위25～88μm，용해속솔위9s，순도체99.87%。장양화동용우대불용성양겁적전도체계중，능대동리자농도진행유효보충。장전자급양화동분말응용우전도동공예，능사고후경비적통공、미맹공이급HDI판상조합적통공여미맹공형성고성능적동도층。
Microvias for high-density interconnection (HDI) are important for the development of printed circuit boards. Electronic-grade copper oxide with aggregated porous microplates was prepared from thermal decomposition of basic copper carbonate. Porous copper oxide exhibited a particulate distribution mainly ranging from 25μm to 88μm. Copper oxide exhibited a high dissolution rate of 9s and a purity of 99.87wt%. Copper oxide was employed to complement the concentration of cupric ions in a plating system with insoluble anode. Electronic-grade copper oxide could be used for copper electrodeposition to form high-performance metallization of through holes with a high aspect ratio, microvias, and combination of through holes and microvias in HDI printed circuit boards.