电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2015年
1期
25-29
,共5页
铜基体%金镀层%电接触润滑保护剂%耐蚀性%电气性能
銅基體%金鍍層%電接觸潤滑保護劑%耐蝕性%電氣性能
동기체%금도층%전접촉윤활보호제%내식성%전기성능
copper substrate%gold coating%electrical contact lubrication protective agent%corrosion resistance%electrical property
介绍了可代替铜及铜合金基体镀金用的保护材料──溶剂型SP-2085C和水溶性LP-1087C电接触润滑保护剂,说明了其制备方法与涂覆工艺。通过抗腐蚀性试验(湿热、SO2气氛和盐雾)及电气性能试验(抗电强度、绝缘电阻、接触电阻、微波性能和可焊性),并与镀金板以及未做处理的基材对比,证明这2种材料不仅能替代镀金,而且涂覆后的铜表面耐蚀性优于镀金表面,电气性能和微波传输性未受影响,对环境更友好,且成本更低。
介紹瞭可代替銅及銅閤金基體鍍金用的保護材料──溶劑型SP-2085C和水溶性LP-1087C電接觸潤滑保護劑,說明瞭其製備方法與塗覆工藝。通過抗腐蝕性試驗(濕熱、SO2氣氛和鹽霧)及電氣性能試驗(抗電彊度、絕緣電阻、接觸電阻、微波性能和可銲性),併與鍍金闆以及未做處理的基材對比,證明這2種材料不僅能替代鍍金,而且塗覆後的銅錶麵耐蝕性優于鍍金錶麵,電氣性能和微波傳輸性未受影響,對環境更友好,且成本更低。
개소료가대체동급동합금기체도금용적보호재료──용제형SP-2085C화수용성LP-1087C전접촉윤활보호제,설명료기제비방법여도복공예。통과항부식성시험(습열、SO2기분화염무)급전기성능시험(항전강도、절연전조、접촉전조、미파성능화가한성),병여도금판이급미주처리적기재대비,증명저2충재료불부능체대도금,이차도복후적동표면내식성우우도금표면,전기성능화미파전수성미수영향,대배경경우호,차성본경저。
The solvent type SP-2085C and water-soluble LP-1087C electrical contact lubrication protective agents used for replacing gold plating on copper and copper alloy substrates were introduced. Their preparation and coating processes were described. Through corrosion resistance tests (damp-heat, sulfur dioxide atmosphere, and salt spray) and electrical property tests (dielectric strength, insulation resistance, contact resistance, microwave transmission, and weldability), it was showed that, compared with the substrates coated with gold and untreated ones, the two materials not only can substitute gold plating, but also provide better corrosion resistance for copper and copper alloy surfaces than gold plating, not affecting the electrical properties and microwave transmission of products. Besides, the two materials are more environmentally friendly with lower prices.