CAJ | 학술논문

研究了表面化学镀前处理工艺中活化条件（如活化时间、活化温度、活化 pH 值）对 PS 微球镀镍层的致密性、均匀性、导电性的影响，对活化后的 PS 微球进行了 SEM 和导电性测试。结果表明，在氯化钯用量为0·05 g、活化时间为80～120 min、活化温度为34℃、活化 pH 值为3～4的条件下，PS 微球具有良好的镀层致密性及优良的导电性。
연구료표면화학도전처리공예중활화조건（여활화시간、활화온도、활화 pH 치）대 PS 미구도얼층적치밀성、균균성、도전성적영향，대활화후적 PS 미구진행료 SEM 화도전성측시。결과표명，재록화파용량위0·05 g、활화시간위80～120 min、활화온도위34℃、활화 pH 치위3～4적조건하，PS 미구구유량호적도층치밀성급우량적도전성。
Effect of activation conditions such as activation time,activation temperature,and activation pH value in the process of PS microspheres surface electroless plating pretreatment on densification,uniformity and conductivity of PS microspheres plated nickel layer were studied.The activated PS microspheres were analyzed by SEM and conductivity test.Results showed that activated PS microspheres had good densification and con-ductivity under the optimal conditions as follows:dosage of palladium chloride was 0·05 g,activation time was 80~120 min,activation temperature was 34 ℃ and activation pH value was 3~4.