电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2015年
3期
85-89
,共5页
刘培生%杨龙龙%卢颖%刘亚鸿
劉培生%楊龍龍%盧穎%劉亞鴻
류배생%양룡룡%로영%류아홍
倒装芯片%电流密度%可靠性%焦耳热%空洞%集成电路
倒裝芯片%電流密度%可靠性%焦耳熱%空洞%集成電路
도장심편%전류밀도%가고성%초이열%공동%집성전로
flip chip%current density%reliability%Joule heat%void%integrated circuit
由于电流聚集,在倒装芯片封装技术中,电迁移已经成为一个关键的可靠性问题。分析了电迁移力和电迁移中值失效时间,采用二维模型研究了电流密度和焦耳热在倒装芯片互连结构中的分布以及影响电流密度和焦耳热分布的因素。结果表明铝线(Al)和凸点下金属层(UBM)的厚度对电流密度和焦耳热分布有很大的影响。
由于電流聚集,在倒裝芯片封裝技術中,電遷移已經成為一箇關鍵的可靠性問題。分析瞭電遷移力和電遷移中值失效時間,採用二維模型研究瞭電流密度和焦耳熱在倒裝芯片互連結構中的分佈以及影響電流密度和焦耳熱分佈的因素。結果錶明鋁線(Al)和凸點下金屬層(UBM)的厚度對電流密度和焦耳熱分佈有很大的影響。
유우전류취집,재도장심편봉장기술중,전천이이경성위일개관건적가고성문제。분석료전천이력화전천이중치실효시간,채용이유모형연구료전류밀도화초이열재도장심편호련결구중적분포이급영향전류밀도화초이열분포적인소。결과표명려선(Al)화철점하금속층(UBM)적후도대전류밀도화초이열분포유흔대적영향。
Electro-migration becomes a critical reliability issue for high density solder joints in flip chip technology, especially for current crowding. Electro-migration force and mean time to failure of flip chip were analyzed. This study employed two-dimensional simulation to investigate the distribution of current density and Joule heat in the flip chip joint. And the factors that impact the distribution of current density and Joule heat were studied. The results show that the thicknesses of Al and UBM have great influences on the distribution of current density and Joule heat.