电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2015年
2期
47-52
,共6页
谢洪彬%张邈%张丝雨%王立达%刘贵昌
謝洪彬%張邈%張絲雨%王立達%劉貴昌
사홍빈%장막%장사우%왕립체%류귀창
二氧化锰%微米容器%苯并三氮唑%缓蚀剂%封装%铜%防腐
二氧化錳%微米容器%苯併三氮唑%緩蝕劑%封裝%銅%防腐
이양화맹%미미용기%분병삼담서%완식제%봉장%동%방부
manganese dioxide%micro-container%benzotriazole%corrosion inhibitor%encapsulation%copper%corrosion protection
通过模板法制备了二氧化锰微米容器,利用脱溶剂法实现了微米容器对苯并三氮唑(BTA)的封装。通过扫描电子显微镜和X射线衍射仪表征了微米容器的表面形貌及晶体结构,使用红外光谱确定了微米容器对BTA缓蚀剂的负载,利用紫外可见分光光度计、交流阻抗谱、动电位极化曲线等测试手段分析了携载BTA缓蚀剂的MnO2微米容器在模拟海水中BTA的释放速率及缓蚀性能。结果表明,脱溶剂法可有效地实现MnO2微米容器对BTA缓蚀剂的封装,封装量为3.9%,而且携载BTA缓蚀剂的MnO2微米容器在3.5%NaCl溶液中能有效地释放BTA,实现了对铜基体的腐蚀防护。
通過模闆法製備瞭二氧化錳微米容器,利用脫溶劑法實現瞭微米容器對苯併三氮唑(BTA)的封裝。通過掃描電子顯微鏡和X射線衍射儀錶徵瞭微米容器的錶麵形貌及晶體結構,使用紅外光譜確定瞭微米容器對BTA緩蝕劑的負載,利用紫外可見分光光度計、交流阻抗譜、動電位極化麯線等測試手段分析瞭攜載BTA緩蝕劑的MnO2微米容器在模擬海水中BTA的釋放速率及緩蝕性能。結果錶明,脫溶劑法可有效地實現MnO2微米容器對BTA緩蝕劑的封裝,封裝量為3.9%,而且攜載BTA緩蝕劑的MnO2微米容器在3.5%NaCl溶液中能有效地釋放BTA,實現瞭對銅基體的腐蝕防護。
통과모판법제비료이양화맹미미용기,이용탈용제법실현료미미용기대분병삼담서(BTA)적봉장。통과소묘전자현미경화X사선연사의표정료미미용기적표면형모급정체결구,사용홍외광보학정료미미용기대BTA완식제적부재,이용자외가견분광광도계、교류조항보、동전위겁화곡선등측시수단분석료휴재BTA완식제적MnO2미미용기재모의해수중BTA적석방속솔급완식성능。결과표명,탈용제법가유효지실현MnO2미미용기대BTA완식제적봉장,봉장량위3.9%,이차휴재BTA완식제적MnO2미미용기재3.5%NaCl용액중능유효지석방BTA,실현료대동기체적부식방호。
The MnO2 micro-containers were prepared by template method, and then used to encapsulate benzotriazole (BTA), a corrosion inhibitor, through desolvation process. The surface morphology and crystal structure of the micro-containers were characterized by scanning electron microscopy (SEM) and X-ray diffraction (XRD). The loading of BTA in MnO2 micro-containers was confirmed by Fourier-transform infrared spectroscopy (FT-IR), and the releasing rate of BTA from the micro-containers in simulated seawater was analyzed by ultraviolet-visible spectrophotometry (UV), electrochemical impedance spectroscopy (EIS), and potentiodynamic polarization curve measurement. The results indicated that BTA can be effectively encapsulated by MnO2 micro-container by desolvation process with a loading capacity up to 3.9%, and releases effectively from MnO2 micro-container in 3.5%NaCl solution, achieving the corrosion protection for copper substrate.