功能材料
功能材料
공능재료
JOURNAL OF FUNCTIONAL MATERIALS
2015年
5期
5123-5127
,共5页
卷绕型磁控溅射%纳米结构Cu薄膜%X射线衍射仪%原子力显微镜(AFM)%导电性能
捲繞型磁控濺射%納米結構Cu薄膜%X射線衍射儀%原子力顯微鏡(AFM)%導電性能
권요형자공천사%납미결구Cu박막%X사선연사의%원자력현미경(AFM)%도전성능
winding type magnetron sputtering%nano-copper film%X-ray diffractometer (XRD)%atomic force mi-croscope (AFM)%conductivity
采用卷绕型磁控溅射设备在涤纶(PET)针刺毡表面沉积了纳米结构 Cu 薄膜,利用 X 射线衍射仪(XRD)对薄膜的组分和结晶状态进行了分析,用原子力显微镜(AFM)分析了不同溅射工艺参数对纳米Cu薄膜微观结构和颗粒直径的影响,并较为系统地分析了溅射功率、工作气压和沉积时间对镀铜PET针刺毡导电性能的影响。结果表明,增大溅射功率,镀铜PET针刺毡导电性和 Cu 膜均匀性变好,但应控制在6 kW以下;随工作气压的增大,薄膜方块电阻先减小后增大,薄膜厚度更加均匀;随着沉积时间的延长,Cu粒子的直径增大,Cu膜的导电性和均匀性明显变好。
採用捲繞型磁控濺射設備在滌綸(PET)針刺氈錶麵沉積瞭納米結構 Cu 薄膜,利用 X 射線衍射儀(XRD)對薄膜的組分和結晶狀態進行瞭分析,用原子力顯微鏡(AFM)分析瞭不同濺射工藝參數對納米Cu薄膜微觀結構和顆粒直徑的影響,併較為繫統地分析瞭濺射功率、工作氣壓和沉積時間對鍍銅PET針刺氈導電性能的影響。結果錶明,增大濺射功率,鍍銅PET針刺氈導電性和 Cu 膜均勻性變好,但應控製在6 kW以下;隨工作氣壓的增大,薄膜方塊電阻先減小後增大,薄膜厚度更加均勻;隨著沉積時間的延長,Cu粒子的直徑增大,Cu膜的導電性和均勻性明顯變好。
채용권요형자공천사설비재조륜(PET)침자전표면침적료납미결구 Cu 박막,이용 X 사선연사의(XRD)대박막적조분화결정상태진행료분석,용원자력현미경(AFM)분석료불동천사공예삼수대납미Cu박막미관결구화과립직경적영향,병교위계통지분석료천사공솔、공작기압화침적시간대도동PET침자전도전성능적영향。결과표명,증대천사공솔,도동PET침자전도전성화 Cu 막균균성변호,단응공제재6 kW이하;수공작기압적증대,박막방괴전조선감소후증대,박막후도경가균균;수착침적시간적연장,Cu입자적직경증대,Cu막적도전성화균균성명현변호。
Nano-copper film was deposited on polyester needle-punched filter felt by winding type magnetron sputtering equipment.The components and crystalline state of nano-copper film were analyzed by using X-ray diffractometer (XRD).Atomic force microscope (AFM)was also used to characterize the microstructures of Cu thin films deposited on the surface of PET needled felt.The influence of the sputtering power,working pressure and deposition time on conductivity of copper coated PET needled felt was investigated systematically.Experi-mental results show that the conductivity and uniformity of copper film become better while the sputtering pow-er is increased.But it should be controlled under 6 kW.With the increase of working pressure,the square resist-ance of Cu thin film increases with the decrease in the first,and thin film thickness become more uniform.As the extension of deposition time,the diameters of the copper particles increase,while the conductivity and uni-formity of copper film significantly better.