计算机与数字工程
計算機與數字工程
계산궤여수자공정
COMPUTER & DIGITAL ENGINEERING
2015年
1期
7-9,79
,共4页
马清桃%张吉%杨城%潘凌宇
馬清桃%張吉%楊城%潘凌宇
마청도%장길%양성%반릉우
电子元器件%可焊性测试仪%校准方法
電子元器件%可銲性測試儀%校準方法
전자원기건%가한성측시의%교준방법
electronic component%solderability tester%calibration method
可焊性测试仪是电子元器件在生产过程中、筛选复验和装机前进行可焊性测试的仪器,其技术指标包括温度、润湿力、浸渍深度、速率和时间论文依据相关国家检定规范,通过实践研究,实现了可焊性测试仪这些技术指标的校准。
可銲性測試儀是電子元器件在生產過程中、篩選複驗和裝機前進行可銲性測試的儀器,其技術指標包括溫度、潤濕力、浸漬深度、速率和時間論文依據相關國傢檢定規範,通過實踐研究,實現瞭可銲性測試儀這些技術指標的校準。
가한성측시의시전자원기건재생산과정중、사선복험화장궤전진행가한성측시적의기,기기술지표포괄온도、윤습력、침지심도、속솔화시간논문의거상관국가검정규범,통과실천연구,실현료가한성측시의저사기술지표적교준。
The solderability tester is an instrument, which is used to test the solderability of the electronic components during the producing progress, screening retest and before loading the weapon system. According to relative verification reg‐ulation, on the basis of the practical work, the calibration method of the electronic component solderability tester is dis‐cussed, the calibration of such technical specifications as temperature, wetting balance, dipping depth, dipping rate and dip‐ping time etc is realized.