CAJ | 학술논문

分析硅通孔（through-silicon via，TSV）立体集成用于计算机处理芯片的优势。介绍 TSV 立体集成计算机处理器模块单元指令调度集、KS 加法器和对数移位器等的发展现状，以及利用 TSV 立体集成技术的3D 立体架构代替平面架构所带来的功耗降低和性能提升的巨大优势。
분석규통공（through-silicon via，TSV）입체집성용우계산궤처리심편적우세。개소 TSV 입체집성계산궤처리기모괴단원지령조도집、KS 가법기화대수이위기등적발전현상，이급이용 TSV 입체집성기술적3D 입체가구대체평면가구소대래적공모강저화성능제승적거대우세。
The benefits of three-dimensional computer based on through-silicon via(TSV)are introduced.In particu-lar,the development of unit instruction scheduler,KS adder and Log shifter in 3D architecture is overviewed.Then the huge benefits of low power and performance improvement from the adoption of 3D architecture are analyzed.