中国有色金属学报(英文版)
中國有色金屬學報(英文版)
중국유색금속학보(영문판)
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
2015年
1期
36-45
,共10页
Al/Cu层状复合材料%轧制复合%界面%超细晶
Al/Cu層狀複閤材料%軋製複閤%界麵%超細晶
Al/Cu층상복합재료%알제복합%계면%초세정
Al/Cu laminated composite%roll bonding%interface%ultra-fine grain
研究异步冷轧退火工艺制备的Al/Cu多层复合材料的组织演化及其对力学性能的影响。采用SEM和TEM分析界面组织,用界面剥离实验和拉伸实验测试复合板的力学性能。结果表明:异步冷轧复合工艺可以获得界面紧密连接的超细晶多层复合材料。退火促进Al和Cu连接界面上金属原子的扩散,甚至导致金属间化合物的生成。复合板的连接界面在300°C退火时发生固溶强化现象,界面的连接强度达到最大,但是在更高温度退火时界面生成的金属间化合物导致连接性能急剧下降。在300°C退火时,复合板组织发生再结晶并获得较高的抗拉强度;而在350°C退火时,界面存在亚微米厚度的过渡层,有利于位错滑移运动,因此复合板获得较高的伸长率。
研究異步冷軋退火工藝製備的Al/Cu多層複閤材料的組織縯化及其對力學性能的影響。採用SEM和TEM分析界麵組織,用界麵剝離實驗和拉伸實驗測試複閤闆的力學性能。結果錶明:異步冷軋複閤工藝可以穫得界麵緊密連接的超細晶多層複閤材料。退火促進Al和Cu連接界麵上金屬原子的擴散,甚至導緻金屬間化閤物的生成。複閤闆的連接界麵在300°C退火時髮生固溶彊化現象,界麵的連接彊度達到最大,但是在更高溫度退火時界麵生成的金屬間化閤物導緻連接性能急劇下降。在300°C退火時,複閤闆組織髮生再結晶併穫得較高的抗拉彊度;而在350°C退火時,界麵存在亞微米厚度的過渡層,有利于位錯滑移運動,因此複閤闆穫得較高的伸長率。
연구이보랭알퇴화공예제비적Al/Cu다층복합재료적조직연화급기대역학성능적영향。채용SEM화TEM분석계면조직,용계면박리실험화랍신실험측시복합판적역학성능。결과표명:이보랭알복합공예가이획득계면긴밀련접적초세정다층복합재료。퇴화촉진Al화Cu련접계면상금속원자적확산,심지도치금속간화합물적생성。복합판적련접계면재300°C퇴화시발생고용강화현상,계면적련접강도체도최대,단시재경고온도퇴화시계면생성적금속간화합물도치련접성능급극하강。재300°C퇴화시,복합판조직발생재결정병획득교고적항랍강도;이재350°C퇴화시,계면존재아미미후도적과도층,유리우위착활이운동,인차복합판획득교고적신장솔。
The microstructural development and its effect on the mechanical properties of Al/Cu laminated composite produced by asymmetrical roll bonding and annealing were studied. The composite characterizations were conducted by transmission electron microscope (TEM), scanning electron microscope (SEM), peeling tests and tensile tests. It is found that the ultra-fine grained laminated composites with tight bonding interface are prepared by the roll bonding technique. The annealing prompts the atomic diffusion in the interface between dissimilar matrixes, and even causes the formation of intermetallic compounds. The interfacial bonding strength increases to the maximum value owing to the interfacial solution strengthening at 300 °C annealing, but sharply decreases by the damage effect of intermetallic compounds at elevated temperatures. The composites obtain high tensile strength due to the Al crystallization grains and Cu twins at 300 °C. At 350 °C annealing, however, the composites get high elongation by the interfacial interlayer with submicron thickness.