中国有色金属学报(英文版)
中國有色金屬學報(英文版)
중국유색금속학보(영문판)
TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA
2015年
1期
170-174
,共5页
郭宏%韩媛媛%张习敏%贾成厂%徐骏
郭宏%韓媛媛%張習敏%賈成廠%徐駿
곽굉%한원원%장습민%가성엄%서준
金刚石混杂SiCp/Al复合材料%热导率%热膨胀系数%显微组织
金剛石混雜SiCp/Al複閤材料%熱導率%熱膨脹繫數%顯微組織
금강석혼잡SiCp/Al복합재료%열도솔%열팽창계수%현미조직
SiC/Al composites mixed with diamond%thermal conductivity%thermal expansion coefficient%microstructure
采用理论计算与实验相结合的方法对金刚石混杂SiC/Al复合材料的热物理性能进行研究,采用微分有效介质(DEM)理论和扩展的Turner模型分别计算金刚石混杂SiC/Al复合材料的热导率和热膨胀系数。从金刚石混杂SiC/Al复合材料的微观组织可以看到SiC颗粒与Al之间结合较紧密,金刚石颗粒与Al之间结合不紧密。金刚石混杂 SiC/Al 复合材料的热物理性能的实验结果与理论计算趋势一致。当金刚石颗粒与 SiC 颗粒的体积比为3:7时,混杂SiC/Al复合材料的热导率和热膨胀系数分别提高了39%和30%。因此,当在复合材料中加入少量金刚石颗粒时,其热物理性能得到显著提高,而复合材料的成本略有提高。
採用理論計算與實驗相結閤的方法對金剛石混雜SiC/Al複閤材料的熱物理性能進行研究,採用微分有效介質(DEM)理論和擴展的Turner模型分彆計算金剛石混雜SiC/Al複閤材料的熱導率和熱膨脹繫數。從金剛石混雜SiC/Al複閤材料的微觀組織可以看到SiC顆粒與Al之間結閤較緊密,金剛石顆粒與Al之間結閤不緊密。金剛石混雜 SiC/Al 複閤材料的熱物理性能的實驗結果與理論計算趨勢一緻。噹金剛石顆粒與 SiC 顆粒的體積比為3:7時,混雜SiC/Al複閤材料的熱導率和熱膨脹繫數分彆提高瞭39%和30%。因此,噹在複閤材料中加入少量金剛石顆粒時,其熱物理性能得到顯著提高,而複閤材料的成本略有提高。
채용이론계산여실험상결합적방법대금강석혼잡SiC/Al복합재료적열물이성능진행연구,채용미분유효개질(DEM)이론화확전적Turner모형분별계산금강석혼잡SiC/Al복합재료적열도솔화열팽창계수。종금강석혼잡SiC/Al복합재료적미관조직가이간도SiC과립여Al지간결합교긴밀,금강석과립여Al지간결합불긴밀。금강석혼잡 SiC/Al 복합재료적열물이성능적실험결과여이론계산추세일치。당금강석과립여 SiC 과립적체적비위3:7시,혼잡SiC/Al복합재료적열도솔화열팽창계수분별제고료39%화30%。인차,당재복합재료중가입소량금강석과립시,기열물이성능득도현저제고,이복합재료적성본략유제고。
The thermophysical properties of the SiC/Al composites mixed with diamond (SiC-Dia/Al) were studied through theoretical calculation and experiments. The thermal conductivity and the thermal expansion coefficient of the SiC-Dia/Al were calculated by differential effective medium (DEM) theoretical model and extended Turner model, respectively. The microstructure of the SiC-Dia/Al shows that the combination between SiC particles and Al is close, while that between diamond particles and Al is not close. The experimental results of the thermophysical properties of the SiC-Dia/Al are consistent with the calculated ones. The calculation results show that when the volume ratio of the diamond particles to the SiC particles is 3:7, the thermal conductivity and the thermal expansion coefficient can be improved by 39%and 30%compared to SiC/Al composites, respectively. In other words, by adding a small amount of diamond particles, the thermophysical properties of the composites can be improved effectively, while the cost increases little.