功能材料
功能材料
공능재료
JOURNAL OF FUNCTIONAL MATERIALS
2015年
4期
4071-4075
,共5页
花银群%朱爱春%陈瑞芳%郭立强
花銀群%硃愛春%陳瑞芳%郭立彊
화은군%주애춘%진서방%곽립강
直流磁控溅射%铝纳米颗粒薄膜%沉积速率%微结构%电阻率
直流磁控濺射%鋁納米顆粒薄膜%沉積速率%微結構%電阻率
직류자공천사%려납미과립박막%침적속솔%미결구%전조솔
DC magnetron sputtering%Al nano-particle films%sputtering rate%microstructure%electrical resistivity
采用直流磁控溅射法,以高纯铝(99.99%)为靶材,高纯氩气(99.999%)为起辉气体,在经机械抛光的单晶 Si 衬底上制备铝纳米颗粒薄膜.利用 X 射线衍射仪(XRD)、光学薄膜测厚仪、扫描电子显微镜(SEM)和四探针测试仪分别测试了铝纳米颗粒薄膜的晶相结构、薄膜厚度、表面形貌及电阻率.XRD 衍射图谱表明此薄膜为面心立方的多晶结构,择优取向为Al(111)晶面.随溅射功率由30 W 增至300 W,铝纳米颗粒薄膜的沉积速率由3.03 nm/min 增加至20.03 nm/min;而随溅射压强由1 Pa 增加至3 Pa,沉积速率由2.95 nm/min 降低到1.66 nm/min.在溅射功率为150 W,溅射压强为1.0 Pa 条件下制备的样品具有良好的晶粒分布.随溅射功率从80 W 增大到160 W,样品电阻率由4.0×10-7Ω· m 逐渐减小到1.9×10-7Ω·m;而随溅射压强从1 Pa 增至3 Pa,样品电阻率由1.9×10-7Ω·m 增加到7.1×10-7Ω·m.
採用直流磁控濺射法,以高純鋁(99.99%)為靶材,高純氬氣(99.999%)為起輝氣體,在經機械拋光的單晶 Si 襯底上製備鋁納米顆粒薄膜.利用 X 射線衍射儀(XRD)、光學薄膜測厚儀、掃描電子顯微鏡(SEM)和四探針測試儀分彆測試瞭鋁納米顆粒薄膜的晶相結構、薄膜厚度、錶麵形貌及電阻率.XRD 衍射圖譜錶明此薄膜為麵心立方的多晶結構,擇優取嚮為Al(111)晶麵.隨濺射功率由30 W 增至300 W,鋁納米顆粒薄膜的沉積速率由3.03 nm/min 增加至20.03 nm/min;而隨濺射壓彊由1 Pa 增加至3 Pa,沉積速率由2.95 nm/min 降低到1.66 nm/min.在濺射功率為150 W,濺射壓彊為1.0 Pa 條件下製備的樣品具有良好的晶粒分佈.隨濺射功率從80 W 增大到160 W,樣品電阻率由4.0×10-7Ω· m 逐漸減小到1.9×10-7Ω·m;而隨濺射壓彊從1 Pa 增至3 Pa,樣品電阻率由1.9×10-7Ω·m 增加到7.1×10-7Ω·m.
채용직류자공천사법,이고순려(99.99%)위파재,고순아기(99.999%)위기휘기체,재경궤계포광적단정 Si 츤저상제비려납미과립박막.이용 X 사선연사의(XRD)、광학박막측후의、소묘전자현미경(SEM)화사탐침측시의분별측시료려납미과립박막적정상결구、박막후도、표면형모급전조솔.XRD 연사도보표명차박막위면심립방적다정결구,택우취향위Al(111)정면.수천사공솔유30 W 증지300 W,려납미과립박막적침적속솔유3.03 nm/min 증가지20.03 nm/min;이수천사압강유1 Pa 증가지3 Pa,침적속솔유2.95 nm/min 강저도1.66 nm/min.재천사공솔위150 W,천사압강위1.0 Pa 조건하제비적양품구유량호적정립분포.수천사공솔종80 W 증대도160 W,양품전조솔유4.0×10-7Ω· m 축점감소도1.9×10-7Ω·m;이수천사압강종1 Pa 증지3 Pa,양품전조솔유1.9×10-7Ω·m 증가도7.1×10-7Ω·m.
Aluminum nano-particle films are successfully deposited on mechanically polished monocrystal silicon substrates by DC magnetron sputtering,where the highly pure aluminum(99.99%)was used as target with the argon(99.999%)as sputtering gas.The crystal structure,thickness,surface morphology and electrical resistivi-ty were studied by X-ray diffraction (XRD),optical thickness measuring,scanning electron microscopy (SEM) and four point probes meter,respectively.The XRD pattern showed that these Al nano-particle films had pre-ferred orientation of Al (1 1 1 )with fcc polycrystal structure.When sputtering power increased from 30 to 300 W,The deposition rate increased from 3.03 to 20.03 nm/min,while decreased from 2.95 to 1.66 nm/min when the sputtering pressure increased from 1 to 3 Pa.SEM images of surface morphology showed that the Al nano-particle films sputtered at 150 W and 1 Pa were perfect.With the sputtering power increased from 80 W to 1 60 W,the electrical resistivity decreased from 4.0 × 10 -7 Ω·m to 1.9 × 10 -7 Ω·m,while increased from 1.9 × 10 -7 Ω·m to 7.1 × 10 -7 Ω·m with the sputtering pressure increasing from 1 Pa to 3 Pa.