功能材料
功能材料
공능재료
JOURNAL OF FUNCTIONAL MATERIALS
2015年
4期
4061-4065
,共5页
孙皓%王安定%常春涛%门贺%王新敏%潘登
孫皓%王安定%常春濤%門賀%王新敏%潘登
손호%왕안정%상춘도%문하%왕신민%반등
非晶合金%非晶形成能力%软磁性能%高饱和磁感应强度
非晶閤金%非晶形成能力%軟磁性能%高飽和磁感應彊度
비정합금%비정형성능력%연자성능%고포화자감응강도
amorphous alloy%GFA%soft magnetic property%high saturation magnetization
通过在 Fe-Si-B-P 合金体系中微合金化添加Mo 元素,并提高铁含量,成功制备了具有较强非晶形成能力和优异软磁性能的非晶软磁合金.研究发现, Mo 元素微合金化能有效提高合金的非晶形成能力,1%的 Mo 可以将该非晶合金体系的 Fe 含量极限提高到84%以上,从而得到了饱和磁感应强度(B s )高达1.63 T的非晶合金.其中 Fe80 Si4.75 B 9.5 P4.75 Mo 1非晶合金可以铸造形成非晶块体样品,临界直径达到1 mm,饱和磁感应强度达到1.54 T,矫顽力为1.9 A/m.在整个成分范围内,该合金体系都具有1.9~5.1 A/m 的低矫顽力和高于传统 Fe-Si-B 合金的饱和磁感应强度(B s ),具有较好的应用前景.
通過在 Fe-Si-B-P 閤金體繫中微閤金化添加Mo 元素,併提高鐵含量,成功製備瞭具有較彊非晶形成能力和優異軟磁性能的非晶軟磁閤金.研究髮現, Mo 元素微閤金化能有效提高閤金的非晶形成能力,1%的 Mo 可以將該非晶閤金體繫的 Fe 含量極限提高到84%以上,從而得到瞭飽和磁感應彊度(B s )高達1.63 T的非晶閤金.其中 Fe80 Si4.75 B 9.5 P4.75 Mo 1非晶閤金可以鑄造形成非晶塊體樣品,臨界直徑達到1 mm,飽和磁感應彊度達到1.54 T,矯頑力為1.9 A/m.在整箇成分範圍內,該閤金體繫都具有1.9~5.1 A/m 的低矯頑力和高于傳統 Fe-Si-B 閤金的飽和磁感應彊度(B s ),具有較好的應用前景.
통과재 Fe-Si-B-P 합금체계중미합금화첨가Mo 원소,병제고철함량,성공제비료구유교강비정형성능력화우이연자성능적비정연자합금.연구발현, Mo 원소미합금화능유효제고합금적비정형성능력,1%적 Mo 가이장해비정합금체계적 Fe 함량겁한제고도84%이상,종이득도료포화자감응강도(B s )고체1.63 T적비정합금.기중 Fe80 Si4.75 B 9.5 P4.75 Mo 1비정합금가이주조형성비정괴체양품,림계직경체도1 mm,포화자감응강도체도1.54 T,교완력위1.9 A/m.재정개성분범위내,해합금체계도구유1.9~5.1 A/m 적저교완력화고우전통 Fe-Si-B 합금적포화자감응강도(B s ),구유교호적응용전경.
Based on the Fe-Si-B-P amorphous alloy system,we successfully developed the amorphous alloys with large GFA and excellent magnetic properties by micro-alloying Mo element and increasing Fe content.We found that micro addition of Mo can effectively increase the glass forming ability.With only 1% addition of Mo,the Fe limitation to form a single amorphous phase is increased up to 84% leading to a high B s up to 1.63 T.Addi-tionally,the as designed Fe80 Si4.7 5 B9 .5 P4.7 5 Mo 1 alloy can form a glassy rod with a Dcr of 1 mm exhibiting a high B s of 1.54 T and low H c of 1.9 A/m.Owning to the excellent magnetic properties such as low H c of 1.9-5.1 A/m and higher B s than traditional Fe-Si-B amorphous alloys,the present alloy system is believed to be promising soft magnetic materials for the application in the future.