CAJ | 학술논문

介绍了一种多通道瓦片式T/R组件的研制方法和关键技术。针对组件结构尺寸紧张、工作频率高且频带宽的要求，提出了一种新的高集成T/R组件三维立体组装方法，同时采用了多功能单片微波集成电路( MMIC)芯片技术、多芯片组装( MCM)技术提高集成度。通过对组件的热设计和密封性设计，确保了组件使用的长期可靠性。成功研制出尺寸为41.8 mm×8 mm×8.2 mm、质量不超过13 g的瓦片式T/R组件，具有4个收发通道，每个通道包含6位数控移相器和6位数控衰减器。该组件集成度高、散热性好、可靠性高，较传统T/R组件在尺寸和重量上具有突破性的优势，大大减小了雷达尺寸，使其更好地满足高性能共形有源相控阵雷达的需要。
개소료일충다통도와편식T/R조건적연제방법화관건기술。침대조건결구척촌긴장、공작빈솔고차빈대관적요구，제출료일충신적고집성T/R조건삼유입체조장방법，동시채용료다공능단편미파집성전로( MMIC)심편기술、다심편조장( MCM)기술제고집성도。통과대조건적열설계화밀봉성설계，학보료조건사용적장기가고성。성공연제출척촌위41.8 mm×8 mm×8.2 mm、질량불초과13 g적와편식T/R조건，구유4개수발통도，매개통도포함6위수공이상기화6위수공쇠감기。해조건집성도고、산열성호、가고성고，교전통T/R조건재척촌화중량상구유돌파성적우세，대대감소료뢰체척촌，사기경호지만족고성능공형유원상공진뢰체적수요。
Design method and key technologies of a tile-type T/R module are given. In order to meet the re-quirements of limited size,high operation frequency and wide bandwidth of the module,a new assembly meth-od of three dimensional(3D) cubic packaging technology in the highly integrated packaging T/R module is proposed,and the multifunctional monolithic microwave integrated circuit(MMIC) chip technique and multi-chip module( MCM) technique are also adopted to increase the integration level. The long-term reliability of the module is ensured by the thermal design and the sealing design. Finally,a tile-type T/R module with the size of 41. 8 mm×8 mm×8. 2 mm and the weight less than 13 g has been developed successfully. The module has 4 receiver and transmitter channels,and each channel has a 6 bit phase shifter and a 6 bit attenuator. The tile-type T/R module features high integration level, good heat dissipation, high reliability and has more breakthrough advantages on the size and weight than the conventional T/R module. It also can reduce the size of radar to satisfy the requirement of high performance conformal active phased array radars.