计算机科学与探索
計算機科學與探索
계산궤과학여탐색
JOURNAL OF FRONTIERS OF COMPUTER SCIENCE & TECHNOLOGY
2015年
2期
129-164
,共36页
张大坤%宋国治%王莲莲%黄翠
張大坤%宋國治%王蓮蓮%黃翠
장대곤%송국치%왕련련%황취
三维片上网络(3D NoC)%通信瓶颈%拓扑结构%拓扑结构分类
三維片上網絡(3D NoC)%通信瓶頸%拓撲結構%拓撲結構分類
삼유편상망락(3D NoC)%통신병경%탁복결구%탁복결구분류
three-dimensional network on chip (3DNoC)%communication bottleneck%topology%classification of topology
三维片上网络（three-dimensional network on chip ，3D NoC）是在三维集成电路（three-dimensional integrated circuit，3D IC）、片上系统（system on chip，SoC）和二维片上网络（two-dimensional network on chip，2D NoC）的基础上发展起来的，主要解决高集成度芯片通信瓶颈等问题，已引起国内外学术界和产业界的高度重视。3D NoC拓扑结构体现了通信节点在芯片中的布局与连接，对三维芯片性能起决定性作用。简介了2D NoC、2D NoC到3D NoC的演变、3D NoC的优点与存在的问题以及3D NoC解决的关键技术问题，分析了3D NoC总体发展状况。三维拓扑结构是3D NoC设计中的关键问题之一，重点研究了3D NoC拓扑结构的分类方法，从通信角度将3D NoC拓扑结构分成9大类，分类论述了3D NoC拓扑结构，并分析比较了现有63种拓扑结构各自的特点，最后指出了3D NoC拓扑结构的未来研究方向。
三維片上網絡（three-dimensional network on chip ，3D NoC）是在三維集成電路（three-dimensional integrated circuit，3D IC）、片上繫統（system on chip，SoC）和二維片上網絡（two-dimensional network on chip，2D NoC）的基礎上髮展起來的，主要解決高集成度芯片通信瓶頸等問題，已引起國內外學術界和產業界的高度重視。3D NoC拓撲結構體現瞭通信節點在芯片中的佈跼與連接，對三維芯片性能起決定性作用。簡介瞭2D NoC、2D NoC到3D NoC的縯變、3D NoC的優點與存在的問題以及3D NoC解決的關鍵技術問題，分析瞭3D NoC總體髮展狀況。三維拓撲結構是3D NoC設計中的關鍵問題之一，重點研究瞭3D NoC拓撲結構的分類方法，從通信角度將3D NoC拓撲結構分成9大類，分類論述瞭3D NoC拓撲結構，併分析比較瞭現有63種拓撲結構各自的特點，最後指齣瞭3D NoC拓撲結構的未來研究方嚮。
삼유편상망락（three-dimensional network on chip ，3D NoC）시재삼유집성전로（three-dimensional integrated circuit，3D IC）、편상계통（system on chip，SoC）화이유편상망락（two-dimensional network on chip，2D NoC）적기출상발전기래적，주요해결고집성도심편통신병경등문제，이인기국내외학술계화산업계적고도중시。3D NoC탁복결구체현료통신절점재심편중적포국여련접，대삼유심편성능기결정성작용。간개료2D NoC、2D NoC도3D NoC적연변、3D NoC적우점여존재적문제이급3D NoC해결적관건기술문제，분석료3D NoC총체발전상황。삼유탁복결구시3D NoC설계중적관건문제지일，중점연구료3D NoC탁복결구적분류방법，종통신각도장3D NoC탁복결구분성9대류，분류논술료3D NoC탁복결구，병분석비교료현유63충탁복결구각자적특점，최후지출료3D NoC탁복결구적미래연구방향。
Three-dimensional network on chip (3D NoC) is developed based on three-dimensional integrated circuit (3D IC), system on chip (SoC) and two-dimensional network on chip (2D NoC). 3D NoC is mainly used to solve the problems such as communication bottleneck of highly integrated chips. It has attracted great attention from both aca-demia and industry at home and abroad. 3D NoC topology structure reflects the layout and connectivity of communi-cations node in the chip, which is crucial for the performance of 3D chip. This paper introduces 2D NoC, the evolu-tion from 2D NoC to 3D NoC, the advantages and problems of adopting 3D NoC and the key technical issues which can be solved by 3D NoC, and analyzes the overall development of 3D NoC. 3D topology is one of the key prob-lems in the design of 3D NoC. This paper mainly studies the different classification methods for 3D NoC topology and divides 3D NoC topologies into 9 categories in terms of communication, then gives a thorough study of 3D NoC topology structures with comparison and analysis of the characteristics for each topology structure. Finally, this paper indicates the possible future research development of 3D NoC topology.
