CAJ | 학술논문

多层陶瓷电容器（MLCC）在微波模块或组件电子装联焊接过程中，经常出现裂纹、断裂故障。通过模拟MLCC多种焊接方式，制备样品，进行DPA分析，发现目前常用的手工焊接方式会使MLCC产生不同程度的裂纹缺陷。这些裂纹在后续的环境试验中将不断扩大，从而导致产品失效。分析了MLCC裂纹产生的原因和机理，给出了MLCC无损伤的焊接方式。
다층도자전용기（MLCC）재미파모괴혹조건전자장련한접과정중，경상출현렬문、단렬고장。통과모의MLCC다충한접방식，제비양품，진행DPA분석，발현목전상용적수공한접방식회사MLCC산생불동정도적렬문결함。저사렬문재후속적배경시험중장불단확대，종이도치산품실효。분석료MLCC렬문산생적원인화궤리，급출료MLCC무손상적한접방식。
It is common to get cracks or fractures in MLCC during the process of assembling microwave modules. By simulating a variety of soldering methods, preparing samples, and conducting DPA analysis, it is found that manual soldering method currently used leads to MLCCs crack defects at different levels. In the subsequent environment test, the cracks will continue to expand, resulting in product failure. Analyze reasons of MLCC cracks and crack mechanisms. A nondestructive soldering method for MLCC is introduced.