电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2015年
1期
42-44
,共3页
陈以钢%戴立强%绍登云%蓝博
陳以鋼%戴立彊%紹登雲%藍博
진이강%대립강%소등운%람박
微波组件%MLCC%DPA%无损伤焊接
微波組件%MLCC%DPA%無損傷銲接
미파조건%MLCC%DPA%무손상한접
Microwave modules%MLCC%DPA%Nondestructive soldering
多层陶瓷电容器(MLCC)在微波模块或组件电子装联焊接过程中,经常出现裂纹、断裂故障。通过模拟MLCC多种焊接方式,制备样品,进行DPA分析,发现目前常用的手工焊接方式会使MLCC产生不同程度的裂纹缺陷。这些裂纹在后续的环境试验中将不断扩大,从而导致产品失效。分析了MLCC裂纹产生的原因和机理,给出了MLCC无损伤的焊接方式。
多層陶瓷電容器(MLCC)在微波模塊或組件電子裝聯銲接過程中,經常齣現裂紋、斷裂故障。通過模擬MLCC多種銲接方式,製備樣品,進行DPA分析,髮現目前常用的手工銲接方式會使MLCC產生不同程度的裂紋缺陷。這些裂紋在後續的環境試驗中將不斷擴大,從而導緻產品失效。分析瞭MLCC裂紋產生的原因和機理,給齣瞭MLCC無損傷的銲接方式。
다층도자전용기(MLCC)재미파모괴혹조건전자장련한접과정중,경상출현렬문、단렬고장。통과모의MLCC다충한접방식,제비양품,진행DPA분석,발현목전상용적수공한접방식회사MLCC산생불동정도적렬문결함。저사렬문재후속적배경시험중장불단확대,종이도치산품실효。분석료MLCC렬문산생적원인화궤리,급출료MLCC무손상적한접방식。
It is common to get cracks or fractures in MLCC during the process of assembling microwave modules. By simulating a variety of soldering methods, preparing samples, and conducting DPA analysis, it is found that manual soldering method currently used leads to MLCCs crack defects at different levels. In the subsequent environment test, the cracks will continue to expand, resulting in product failure. Analyze reasons of MLCC cracks and crack mechanisms. A nondestructive soldering method for MLCC is introduced.