电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2015年
1期
32-33,50
,共3页
大面积接地%多层印制板%预热板%手工焊接
大麵積接地%多層印製闆%預熱闆%手工銲接
대면적접지%다층인제판%예열판%수공한접
Large grounding area%Multi-layers PCB%Preheat equipment%Manual soldering
随着电子产品向密集化方向发展，多层印制板的应用越来越广泛。手工焊接带有大面积接地的多层板时，由于印制板大面积接地的特殊性，导致烙铁在焊接过程中热损失快、焊锡不能充分流动，从而无法完成焊接。针对此问题，采用一种新型的加热方式—预热板。通过工艺试验，寻找最佳匹配温控烙铁的预热板工艺参数，解决了此类印制板焊接难的问题。
隨著電子產品嚮密集化方嚮髮展，多層印製闆的應用越來越廣汎。手工銲接帶有大麵積接地的多層闆時，由于印製闆大麵積接地的特殊性，導緻烙鐵在銲接過程中熱損失快、銲錫不能充分流動，從而無法完成銲接。針對此問題，採用一種新型的加熱方式—預熱闆。通過工藝試驗，尋找最佳匹配溫控烙鐵的預熱闆工藝參數，解決瞭此類印製闆銲接難的問題。
수착전자산품향밀집화방향발전，다층인제판적응용월래월엄범。수공한접대유대면적접지적다층판시，유우인제판대면적접지적특수성，도치락철재한접과정중열손실쾌、한석불능충분류동，종이무법완성한접。침대차문제，채용일충신형적가열방식—예열판。통과공예시험，심조최가필배온공락철적예열판공예삼수，해결료차류인제판한접난적문제。
With the development of electronic products to the direction of intensive, multi-layers PCB are adopted. Manual soldering multi-layers PCB with large grounding area is difficult because soldering iron heat loss is fast in the process of soldering, and solder is not fully flow. For this problem, adopt a new type of heating mode—preheat equipment. Through the technological test to find the best process parameters in the allowable range of GJB, solve soldering problem.
