电子工艺技术
電子工藝技術
전자공예기술
ELECTRONICS PROCESS TECHNOLOGY
2015年
1期
15-17,41
,共4页
皋利利%包晓云%王丽虹%唐怀明
皋利利%包曉雲%王麗虹%唐懷明
고리리%포효운%왕려홍%당부명
大面积钎焊%高钎透率%焊接工艺方法%焊点微观组织
大麵積釬銲%高釬透率%銲接工藝方法%銲點微觀組織
대면적천한%고천투솔%한접공예방법%한점미관조직
Large area soldering%Soldering rate,Soldering process%Solder joint microstructure
研究了不同焊接工艺方法、焊膏量以及焊接材料（Sn37Pb、Sn3.5Ag）对微带板与垫板之间大面积钎焊质量的影响。X光检测结果表明，采用优化后的焊接工艺方法及焊膏量，微带板与垫板之间大面积钎焊钎透率可达95%以上；焊点微观组织分析结果表明，Sn3.5Ag焊点内部存在较大尺寸的脆性金属间化合物相，对焊点的力学性能有不利影响，建议使用Sn37Pb焊料进行微带板的焊接。
研究瞭不同銲接工藝方法、銲膏量以及銲接材料（Sn37Pb、Sn3.5Ag）對微帶闆與墊闆之間大麵積釬銲質量的影響。X光檢測結果錶明，採用優化後的銲接工藝方法及銲膏量，微帶闆與墊闆之間大麵積釬銲釬透率可達95%以上；銲點微觀組織分析結果錶明，Sn3.5Ag銲點內部存在較大呎吋的脆性金屬間化閤物相，對銲點的力學性能有不利影響，建議使用Sn37Pb銲料進行微帶闆的銲接。
연구료불동한접공예방법、한고량이급한접재료（Sn37Pb、Sn3.5Ag）대미대판여점판지간대면적천한질량적영향。X광검측결과표명，채용우화후적한접공예방법급한고량，미대판여점판지간대면적천한천투솔가체95%이상；한점미관조직분석결과표명，Sn3.5Ag한점내부존재교대척촌적취성금속간화합물상，대한점적역학성능유불리영향，건의사용Sn37Pb한료진행미대판적한접。
Effects of soldering process, solder paste volume and solder material (Sn37Pb and Sn3.5Ag) on the quality of large area soldering about substrate and baseplate were studied. The X-Ray results show that the soldering coverage of substrate and baseplate is over 95%with optimized soldering process and solder paste volume. The microstructure analysis results show that brittle intermetallic compounds were observed in Sn3.5Ag solder joints which will deteriorate the mechanical property of the solder joint. Sn37Pb alloy is recommended for soldering of the substrate and baseplate.
