CAJ | 학술논문

小型化、高性能的BGA无铅器件已成为现代高集成度电子产品的组装必需器件，在其服役过程中，会经历热循环，出现失效。使用扫描电镜（SEM）、电子背散射衍射分析（EBSD）和显微硬度，对经历热循环BGA器件损伤模式进行了研究。得出结论：材料的热膨胀系数失配为裂纹萌生和扩展提供了驱动力，裂纹沿着钎料球内部弱化的局部再结晶晶界扩展，最终导致焊点断裂失效。
소형화、고성능적BGA무연기건이성위현대고집성도전자산품적조장필수기건，재기복역과정중，회경력열순배，출현실효。사용소묘전경（SEM）、전자배산사연사분석（EBSD）화현미경도，대경력열순배BGA기건손상모식진행료연구。득출결론：재료적열팽창계수실배위렬문맹생화확전제공료구동력，렬문연착천료구내부약화적국부재결정정계확전，최종도치한점단렬실효。
The compact and high-performance Lead-free BGA device has become the high integrated device which is required in electronics assembly. In the course of service, they experience thermal cycling and maybe invalid. The failure mode of BGA device, which has undergone the thermal cycling, is investigated by scanning electronic microscope, electron back scattered diffraction and micro Vickers hardness tester. It concludes that the mismatch of the coefficient of thermal expansion between materials provides the driving force for the initiation and propagation of cracks which are along the grain boundaries of the local recrystallization weakened in the solder ball, and eventually the fracture of solder joint occurs.