绝缘材料
絕緣材料
절연재료
INSULATING MATERIALS
2015年
4期
14-16,20
,共4页
汪英%周福龙%王汝柯%李耀星
汪英%週福龍%王汝柯%李耀星
왕영%주복룡%왕여가%리요성
聚酰亚胺%多孔薄膜%成孔剂%介电常数
聚酰亞胺%多孔薄膜%成孔劑%介電常數
취선아알%다공박막%성공제%개전상수
polyimide%porous film%pore-forming agent%dielectric constant
以3,3′,4,4′-联苯四甲酸二酐和4,4′-二氨基二苯醚为单体,以三聚氰胺为成孔剂,制得一种聚酰亚胺多孔薄膜,并对薄膜的微观结构、力学性能及介电常数等进行测试。结果表明:制备该聚酰亚胺多孔薄膜的成孔工艺简单可行,三聚氰胺成孔剂可用热水溶解的方法去除。多孔薄膜孔洞数量多,且分布比较均匀。薄膜的介电常数较低、力学性能良好、吸湿率较低。当三聚氰胺添加量分别为25%和40%时,聚酰亚胺多孔薄膜的介电常数分别为1.82和1.36,聚酰亚胺多孔薄膜的拉伸强度分别为86 MPa和74 MPa,断裂伸长率分别为15%和10%。
以3,3′,4,4′-聯苯四甲痠二酐和4,4′-二氨基二苯醚為單體,以三聚氰胺為成孔劑,製得一種聚酰亞胺多孔薄膜,併對薄膜的微觀結構、力學性能及介電常數等進行測試。結果錶明:製備該聚酰亞胺多孔薄膜的成孔工藝簡單可行,三聚氰胺成孔劑可用熱水溶解的方法去除。多孔薄膜孔洞數量多,且分佈比較均勻。薄膜的介電常數較低、力學性能良好、吸濕率較低。噹三聚氰胺添加量分彆為25%和40%時,聚酰亞胺多孔薄膜的介電常數分彆為1.82和1.36,聚酰亞胺多孔薄膜的拉伸彊度分彆為86 MPa和74 MPa,斷裂伸長率分彆為15%和10%。
이3,3′,4,4′-련분사갑산이항화4,4′-이안기이분미위단체,이삼취청알위성공제,제득일충취선아알다공박막,병대박막적미관결구、역학성능급개전상수등진행측시。결과표명:제비해취선아알다공박막적성공공예간단가행,삼취청알성공제가용열수용해적방법거제。다공박막공동수량다,차분포비교균균。박막적개전상수교저、역학성능량호、흡습솔교저。당삼취청알첨가량분별위25%화40%시,취선아알다공박막적개전상수분별위1.82화1.36,취선아알다공박막적랍신강도분별위86 MPa화74 MPa,단렬신장솔분별위15%화10%。
A polyimide porous film was prepared by using 3,3’,4,4’-biphenyltetracarboxylic dianhydride and 4,4’-diaminodiphenyl ether as monomer, melamine as pore-forming agent, and its microstructure, mechanical properties, and dielectric constant were tested. The results show that the pore-forming process of the polyimide porous film is simple and feasible, and the melamine can be dissolved by hot water. The porous films have a great number of pores and their distribution is uniform. And the porous poly-imide films have low dielectric constant, good mechnical properties, and low water absorption. When the melamine addition content is 25% and 40%, the dielectric constant of the porous polyimide film is 1.82 and 1.36, the tensile strength is 86 MPa and 74 MPa, and the elongation at break is 15% and 10%, respectively.