CAJ | 학술논문

PCB信号速率和层数的增加使信号完整性分析变得更加重要，改善信号层间通孔性能和最优走线路径是解决多层PCB信号完整性问题的关键所在。首先建立包含多信号层通孔的理论模型，推导计算出通孔的散射参数。然后，分析通孔谐振频率和信号延时等，得出通过改变通孔焊盘、阻焊盘直径等参数改善通孔性能和最优走线路径的方法。最后，基于HFSS仿真软件建立通孔仿真模型，对通孔的谐振频率和信号延时等进行仿真，验证了理论分析方法的有效性。建立的通孔理论模型能够为高速数字电路中的通孔设计提供依据。
PCB신호속솔화층수적증가사신호완정성분석변득경가중요，개선신호층간통공성능화최우주선로경시해결다층PCB신호완정성문제적관건소재。수선건립포함다신호층통공적이론모형，추도계산출통공적산사삼수。연후，분석통공해진빈솔화신호연시등，득출통과개변통공한반、조한반직경등삼수개선통공성능화최우주선로경적방법。최후，기우HFSS방진연건건립통공방진모형，대통공적해진빈솔화신호연시등진행방진，험증료이론분석방법적유효성。건립적통공이론모형능구위고속수자전로중적통공설계제공의거。
The signal integrity analysis is requisite in the high-speed multilayer PCB design .The studies on the performance improvement of through via connecting different signal layers and the route optimization are important to the multilayer PCB signal integrity.In this paper, the model of through via connecting multiple signal layers is built firstly , and its scattering parameters are derived.Then, based on the analysis of resonant frequency and signal delay caused by through via , the performances of through via are improved and the route is optimized by changing the parameters such as diameters of pad and anti -pad.Finally, the through via simulation model is established with HFSS and the resonant frequency and signal delay caused by through via are analyzed .The sim-ulation results validate the availability of theoretical analysis method .The through via model can provide valuable reference to the through via design in high-speed circuit .