CAJ | 학술논문

为分析焦磷酸盐电镀铜出现漏镀的原因，并提出相应的解决方法，采用化学镀的方法在金刚石表面预镀一层镍，然后通过电镀铜加厚。实验表明：预镀过程中并无漏镀，镍层是在加厚的过程中溶掉了。进一步实验验证表明：其原因在于金属镍与铜盐发生了置换反应。为解决这一问题，提出了加大电流和预镀铜两种方案，二者均能大幅改善漏镀现象，但各有优劣。
위분석초린산염전도동출현루도적원인，병제출상응적해결방법，채용화학도적방법재금강석표면예도일층얼，연후통과전도동가후。실험표명：예도과정중병무루도，얼층시재가후적과정중용도료。진일보실험험증표명：기원인재우금속얼여동염발생료치환반응。위해결저일문제，제출료가대전류화예도동량충방안，이자균능대폭개선루도현상，단각유우렬。
A series of experiments were conducted to optimize the process of electroplating Cu&Ni onto diamond and solve the problem of Ni leakage.Results showed that after preplating,the diamond was totally covered by Ni, which just melted during following plating process. Further experiments indicated the reason,which was a displacement reaction between Cu and Ni.To solve this problem, two projects,namely to increase current and to preplate Cu,were proposed.It turned out that both projects worked,while each of them had its own advantages and disadvantages.