红外与激光工程
紅外與激光工程
홍외여격광공정
INFRARED AND LASER ENGINEERING
2015年
3期
816-820
,共5页
红外探测器%快速冷却%接触热阻%数值模拟
紅外探測器%快速冷卻%接觸熱阻%數值模擬
홍외탐측기%쾌속냉각%접촉열조%수치모의
infrared detector%fast cooling%thermal contact resistance%numerical simulation
随着探测技术的飞速发展,红外探测器获得了越来越广泛的应用。对一种快速启动的微型红外探测器内部结构进行了数值模拟和传热计算。模拟结果表明:接触热阻对探测器组件冷却过程和时间的影响显著,通过调整接触热阻的大小,探测器芯片冷却到90 K所用的时间在4~10 s之间变动。初始环境温度和光阑表面发射率对芯片的冷却效果影响不大。节流冷头温度的变化对探测器组件冷却影响较大,当节流冷头温度下降较慢时,其对芯片启动时间影响较大。在实验过程中可以通过优化接触热阻和节流冷头这两个因素来提高探测器组件冷却效果,从而达到更高的要求。
隨著探測技術的飛速髮展,紅外探測器穫得瞭越來越廣汎的應用。對一種快速啟動的微型紅外探測器內部結構進行瞭數值模擬和傳熱計算。模擬結果錶明:接觸熱阻對探測器組件冷卻過程和時間的影響顯著,通過調整接觸熱阻的大小,探測器芯片冷卻到90 K所用的時間在4~10 s之間變動。初始環境溫度和光闌錶麵髮射率對芯片的冷卻效果影響不大。節流冷頭溫度的變化對探測器組件冷卻影響較大,噹節流冷頭溫度下降較慢時,其對芯片啟動時間影響較大。在實驗過程中可以通過優化接觸熱阻和節流冷頭這兩箇因素來提高探測器組件冷卻效果,從而達到更高的要求。
수착탐측기술적비속발전,홍외탐측기획득료월래월엄범적응용。대일충쾌속계동적미형홍외탐측기내부결구진행료수치모의화전열계산。모의결과표명:접촉열조대탐측기조건냉각과정화시간적영향현저,통과조정접촉열조적대소,탐측기심편냉각도90 K소용적시간재4~10 s지간변동。초시배경온도화광란표면발사솔대심편적냉각효과영향불대。절류랭두온도적변화대탐측기조건냉각영향교대,당절류랭두온도하강교만시,기대심편계동시간영향교대。재실험과정중가이통과우화접촉열조화절류랭두저량개인소래제고탐측기조건냉각효과,종이체도경고적요구。
With the rapid development of detection technologies, the infrared detectors have gained more and more applications. The internal structure of a miniature infrared detector for fast cooling- down process was numerically simulated and analyzed in this paper. The simulating result shows that the thermal contact resistance has significant effect on the detector module cooling- down process. By adjusting the contact resistance, the cooling- down time of the detector chip from ambient temperature to 90 K are 4-10 s. The effects of the initial ambient temperature and the diaphragm surface emissivity show few influence on the cooling- down process of the chip. While the temperature of the throttling cool head has a great impact on the cooling- down process. The faster the temperature drops, the shorter the startup time of the chip. Therefore, the detector can be improved by optimizing the thermal contact resistance and the throttling cool head, to achieve the higher requirements.