电子显微学报
電子顯微學報
전자현미학보
JOURNAL OF CHINESE ELECTRON MICROSCOPY SOCIETY
2015年
2期
163-168
,共6页
SEM%浸锡%裂纹扩展路径%组织结构变化%纯锡带
SEM%浸錫%裂紋擴展路徑%組織結構變化%純錫帶
SEM%침석%렬문확전로경%조직결구변화%순석대
SEM%hot-dip tin%crack growth path%microstructure variation%pure tin strip
本试验利用SEM和电阻炉研究一种SEM样品的制备方法,用于观察裂纹路径,并分析断裂后的显微组织变化。结果表明:通过浸镀焊锡,能够在不同断裂方式形成的裂纹轨迹上形成一条明显的“纯锡带”,呈现出裂纹路径。同时该方法能够观察分析拉伸、冲击、断裂韧性及疲劳断裂等过程中产生的二次裂纹路径及断裂表层下的组织演变。
本試驗利用SEM和電阻爐研究一種SEM樣品的製備方法,用于觀察裂紋路徑,併分析斷裂後的顯微組織變化。結果錶明:通過浸鍍銲錫,能夠在不同斷裂方式形成的裂紋軌跡上形成一條明顯的“純錫帶”,呈現齣裂紋路徑。同時該方法能夠觀察分析拉伸、遲擊、斷裂韌性及疲勞斷裂等過程中產生的二次裂紋路徑及斷裂錶層下的組織縯變。
본시험이용SEM화전조로연구일충SEM양품적제비방법,용우관찰렬문로경,병분석단렬후적현미조직변화。결과표명:통과침도한석,능구재불동단렬방식형성적렬문궤적상형성일조명현적“순석대”,정현출렬문로경。동시해방법능구관찰분석랍신、충격、단렬인성급피로단렬등과정중산생적이차렬문로경급단렬표층하적조직연변。
The SEM specimen preparation method was studied for observation of crack path and microstructure development by means of SEM and electric resistance furnace. The results show that by plating solder, the pure tin strip forms along the crack path which has already formed,so the crack path can be exhibited and observed. In the meanwhile, the method can be used to observe and analyze the secondary crack path and the microstructure development underneath the tensile, impact, fracture toughness and fatigue fracture surfaces.