CAJ | 학술논문

采用浸焊方法制备 Cu/Sn-58Bi/Ni 线性焊点，研究5×103 A/cm2、170℃条件下液?固电迁移对Cu/Sn-58Bi/Ni 线性焊点 Cu、Ni 交互作用以及界面反应的影响。无论电流方向如何，在液?固电迁移过程中焊点均表现为“极性效应”，即阳极界面金属间化合物(IMC)持续生长变厚，且一直厚于阴极界面的IMC。电迁移显著加快了Cu、Ni原子的交互作用。当电子由Ni流向Cu时，在化学势梯度和电子风力的耦合作用下，Ni原子扩散至阳极Cu侧参与界面反应生成(Cu,Ni)6Sn5类型IMC，同时一定量的Cu原子能够逆电子风扩散到Ni侧，参与界面反应生成(Cu,Ni)6Sn5类型IMC；当电子由Cu流向Ni时，大量的Cu原子扩散至Ni侧，并参与界面反应生成(Cu,Ni)6Sn5类型IMC，然而，Ni原子在逆电子风条件下无法扩散至Cu侧，从而使阴极Cu侧界面始终为Cu6Sn5类型IMC。此外，无论电流方向如何，焊点内都没有出现Bi的聚集。
채용침한방법제비 Cu/Sn-58Bi/Ni 선성한점，연구5×103 A/cm2、170℃조건하액?고전천이대Cu/Sn-58Bi/Ni 선성한점 Cu、Ni 교호작용이급계면반응적영향。무론전류방향여하，재액?고전천이과정중한점균표현위“겁성효응”，즉양겁계면금속간화합물(IMC)지속생장변후，차일직후우음겁계면적IMC。전천이현저가쾌료Cu、Ni원자적교호작용。당전자유Ni류향Cu시，재화학세제도화전자풍력적우합작용하，Ni원자확산지양겁Cu측삼여계면반응생성(Cu,Ni)6Sn5류형IMC，동시일정량적Cu원자능구역전자풍확산도Ni측，삼여계면반응생성(Cu,Ni)6Sn5류형IMC；당전자유Cu류향Ni시，대량적Cu원자확산지Ni측，병삼여계면반응생성(Cu,Ni)6Sn5류형IMC，연이，Ni원자재역전자풍조건하무법확산지Cu측，종이사음겁Cu측계면시종위Cu6Sn5류형IMC。차외，무론전류방향여하，한점내도몰유출현Bi적취집。
Cu/Sn-58Bi/Ni interconnect was prepared by dip-soldering, the effects of liquid-solid electromigration liquid-solid electromigration (L-S EM) on the Cu-Ni cross-solder interaction and the interfacial reaction in Cu/Sn-58Bi/Ni interconnects were investigated at current density of 5×103 A/cm2 and 170 ℃. Regardless of the current direction, a polarity effect is observed in Cu/Sn-58Bi/Ni interconnects undergoing liquid-solid electromigration (L-S EM), i.e., the interfacial intermetallic compound (IMC) at the anode grows continuously and is obviously thicker than that at the cathode. EM significantly enhances the interaction between Cu and Ni atoms. When electrons flow from Ni to Cu, the diffusion of Ni atoms are significantly enhanced by the combining effect of chemical potential gradient and electronic wind, resulting in the formation of (Cu,Ni)6Sn5 at the anode Cu interface, while a certain amount of Cu atoms diffuse to the Ni cathode interface under upwind diffusion, resulting in the formation of (Cu,Ni)6Sn5. When electrons flow from Cu to Ni, a large number of Cu atoms diffuse to the anode Ni interface, resulting in the formation of (Cu,Ni)6Sn5 IMC. However, Ni atoms are difficult to diffuse to the cathode Cu interface under upwind diffusion, thus, Cu6Sn5 IMC remains at the cathode. Furthermore, regardless of the current direction, Bi atoms do not segregate undergoing electromigration (EM).