电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2015年
3期
149-152
,共4页
无氰镀铜%配位剂%碱性
無氰鍍銅%配位劑%堿性
무청도동%배위제%감성
cyanide-free copper plating%complexant%alkaline
分析了无氰镀铜工艺能否应用于实际生产的关键因素。介绍了国内外常见无氰镀铜工艺,特别是碱性无氰镀铜工艺的研究现状、适用范围及特点。提出了一些无氰镀铜工艺开发的建议。
分析瞭無氰鍍銅工藝能否應用于實際生產的關鍵因素。介紹瞭國內外常見無氰鍍銅工藝,特彆是堿性無氰鍍銅工藝的研究現狀、適用範圍及特點。提齣瞭一些無氰鍍銅工藝開髮的建議。
분석료무청도동공예능부응용우실제생산적관건인소。개소료국내외상견무청도동공예,특별시감성무청도동공예적연구현상、괄용범위급특점。제출료일사무청도동공예개발적건의。
The key factors for application of cyanide-free copper electroplating to actual production were analyzed. The research status, application scope, and technological characteristics of common cyanide-free copper electroplating processes especially alkaline ones at home and abroad were described. Some suggestions about development of cyanide-free copper electroplating were proposed.