电镀与涂饰
電鍍與塗飾
전도여도식
ELECTROPLATING & FINISHING
2015年
4期
217-222
,共6页
锡%锡合金%电镀%晶须%封装%电子工业
錫%錫閤金%電鍍%晶鬚%封裝%電子工業
석%석합금%전도%정수%봉장%전자공업
tin%tin alloy%electroplating%whisker%packaging%electronic industry
概述了电子工业用锡及锡基合金(如锡–银、锡–铜和锡–铋)电子电镀技术的发展现状，重点探讨了了相关电镀工艺、镀层锡晶须生长问题和锡及锡合金电镀在先进封装中的应用现状，最后展望了电子工业用锡及锡合金电镀未来的发展趋势。
概述瞭電子工業用錫及錫基閤金(如錫–銀、錫–銅和錫–鉍)電子電鍍技術的髮展現狀，重點探討瞭瞭相關電鍍工藝、鍍層錫晶鬚生長問題和錫及錫閤金電鍍在先進封裝中的應用現狀，最後展望瞭電子工業用錫及錫閤金電鍍未來的髮展趨勢。
개술료전자공업용석급석기합금(여석–은、석–동화석–필)전자전도기술적발전현상，중점탐토료료상관전도공예、도층석정수생장문제화석급석합금전도재선진봉장중적응용현상，최후전망료전자공업용석급석합금전도미래적발전추세。
The recent advances of tin and tin alloys (such as tin–silver, tin–copper, and tin–bismuth) electroplating in the electronic industry were reviewed. Related electroplating processes, tin whisker growth in coatings, and application status of tin and tin alloy electroplating in advanced electronic packaging were discussed. The future development tendency of tin and tin alloy electroplating in the electronics industry was predicted.
