电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2015年
4期
36-42
,共7页
倒装焊机%UMAC%运动控制
倒裝銲機%UMAC%運動控製
도장한궤%UMAC%운동공제
Flip chip bonding machine%UMAC%Motion controlling
倒装焊机主要实现焊料凸点和金凸点芯片在硅、陶瓷基板上的倒装焊接,其集精密运动控制、机器视觉、加热、加压等功能于一体,设备的运动控制系统,采用UM AC 运动控制器,不但使硬件结构简化,而且解决了控制中高速、高精度运动控制问题,提高了系统的稳定性和可靠性。
倒裝銲機主要實現銲料凸點和金凸點芯片在硅、陶瓷基闆上的倒裝銲接,其集精密運動控製、機器視覺、加熱、加壓等功能于一體,設備的運動控製繫統,採用UM AC 運動控製器,不但使硬件結構簡化,而且解決瞭控製中高速、高精度運動控製問題,提高瞭繫統的穩定性和可靠性。
도장한궤주요실현한료철점화금철점심편재규、도자기판상적도장한접,기집정밀운동공제、궤기시각、가열、가압등공능우일체,설비적운동공제계통,채용UM AC 운동공제기,불단사경건결구간화,이차해결료공제중고속、고정도운동공제문제,제고료계통적은정성화가고성。
The flip chip bonding machine mainly be used in flip bonding of the solder point and gold point on the silicon or chinaw are board,w hich obtains precision motion control,machine vision, heating,pressurization and other functions in the same time. The text mainly introduces the motion controlling systemof flip chip bonding machine,w hich is based on UMAC motion controller. The application of UMAC can not only simplify the hardw are structure,but also solve the control problemofhigh speed,high precision motion controland improve the stability and reliability ofthe system.