电子工业专用设备
電子工業專用設備
전자공업전용설비
EQUIPMENT FOR ELECTRONIC PRODUCTS MANUFACTURING
2015年
4期
22-25
,共4页
晶圆%贴膜棒%贴膜台
晶圓%貼膜棒%貼膜檯
정원%첩막봉%첩막태
Silicon w afer%Film bar%Film table
介绍了芯片超薄化的历程,并且分析了贴膜工艺前移的必要性。阐述了贴膜原理,并对贴膜各阶段实施了压力控制,提出了贴膜台与贴膜棒相平行的调整方法,并且检测了贴膜完成情况。
介紹瞭芯片超薄化的歷程,併且分析瞭貼膜工藝前移的必要性。闡述瞭貼膜原理,併對貼膜各階段實施瞭壓力控製,提齣瞭貼膜檯與貼膜棒相平行的調整方法,併且檢測瞭貼膜完成情況。
개소료심편초박화적역정,병차분석료첩막공예전이적필요성。천술료첩막원리,병대첩막각계단실시료압력공제,제출료첩막태여첩막봉상평행적조정방법,병차검측료첩막완성정황。
Inthispaper,theultrathinningwaferisintroduced,andtherequirementofthefilm technics going ahead is analyzed .Then principle of the film is expatiated , and the various stages of the film is controlled .Finally,the m ethod ofadjusting film barand film table parallelism isputforward,and the com pletion of the film is detected.