电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2015年
3期
5-8,34
,共5页
溶剂扩散%扩散机理%陶瓷封装
溶劑擴散%擴散機理%陶瓷封裝
용제확산%확산궤리%도자봉장
resin bleed out%the mechanisms of bleed out%ceramic package
在微电子行业中，使用贴片胶粘接是一种常见的贴片方法。但该贴片工艺很容易发生溶剂扩散现象，严重的时候甚至会影响后续的组装工艺，该问题在陶瓷外壳上表现得更显著。研究并详细说明溶剂扩散的产生原因和影响关系，重点研究贴片胶在陶瓷外壳金属化表面上的溢出行为。最后，对于溶剂扩散问题给出了定义及相关的解决方法。
在微電子行業中，使用貼片膠粘接是一種常見的貼片方法。但該貼片工藝很容易髮生溶劑擴散現象，嚴重的時候甚至會影響後續的組裝工藝，該問題在陶瓷外殼上錶現得更顯著。研究併詳細說明溶劑擴散的產生原因和影響關繫，重點研究貼片膠在陶瓷外殼金屬化錶麵上的溢齣行為。最後，對于溶劑擴散問題給齣瞭定義及相關的解決方法。
재미전자행업중，사용첩편효점접시일충상견적첩편방법。단해첩편공예흔용역발생용제확산현상，엄중적시후심지회영향후속적조장공예，해문제재도자외각상표현득경현저。연구병상세설명용제확산적산생원인화영향관계，중점연구첩편효재도자외각금속화표면상적일출행위。최후，대우용제확산문제급출료정의급상관적해결방법。
The use of die attach adhesive is an established practice in the micro-electronics industry. A problem which has plagued this die attach method is the phenomena of resin bleed out from the epoxy. When severe, this resin separation can interface with subsequent assembly process. Particularly susceptible to this effect are ceramic chip carriers. The objective of this investigation is to deifne the cause and effect relationship involved with epoxy bleed out. The article focuses on the behavior of die attach adhesive when applied to the metalized surfaces in ceramic chip carriers. The results of the experiments lead ultimately to a deifnition and solution of the bleed out problem.
