江西师范大学学报(自然科学版)
江西師範大學學報(自然科學版)
강서사범대학학보(자연과학판)
JOURNAL OF JIANGXI NORMAL UNIVERSITY(NATURAL SCIENCES EDITION)
2015年
2期
154-158
,共5页
詹美栋%胡顺成%宋琤%宋才生
詹美棟%鬍順成%宋琤%宋纔生
첨미동%호순성%송쟁%송재생
酮酐型聚酰亚胺%TDPA%封端剂
酮酐型聚酰亞胺%TDPA%封耑劑
동항형취선아알%TDPA%봉단제
thermal imidization%TDPA%chemical imidization%adhesion properties
以4,4’-对苯二甲酰二邻苯二甲酸酐( TDPA)和间苯二胺( MPD)为单体,以邻苯二甲酸酐( PA)为封端剂,采用2步法经低温溶液缩聚合成了系列结构新颖的双酮酐型聚酰亚胺( TDPA-PI).采用FT-IR、WAXD、DSC和TGA测试对聚合物的结构与性能进行了表征.考查了封端剂用量及亚胺化方法对酮酐型聚酰亚胺性能的影响. FT-IR表明,2种方法均能使TDPA-PAA亚胺化. DSC和TGA分析表明封端剂可在一定程度上提高PI的热性能,化学亚胺化得到的树脂热性能优于热亚胺化. TDPA-PI属热塑性聚合物, Tg为280.6℃(高于Larc-I-TPI的259℃),具有较好的耐热性和耐溶剂性能.
以4,4’-對苯二甲酰二鄰苯二甲痠酐( TDPA)和間苯二胺( MPD)為單體,以鄰苯二甲痠酐( PA)為封耑劑,採用2步法經低溫溶液縮聚閤成瞭繫列結構新穎的雙酮酐型聚酰亞胺( TDPA-PI).採用FT-IR、WAXD、DSC和TGA測試對聚閤物的結構與性能進行瞭錶徵.攷查瞭封耑劑用量及亞胺化方法對酮酐型聚酰亞胺性能的影響. FT-IR錶明,2種方法均能使TDPA-PAA亞胺化. DSC和TGA分析錶明封耑劑可在一定程度上提高PI的熱性能,化學亞胺化得到的樹脂熱性能優于熱亞胺化. TDPA-PI屬熱塑性聚閤物, Tg為280.6℃(高于Larc-I-TPI的259℃),具有較好的耐熱性和耐溶劑性能.
이4,4’-대분이갑선이린분이갑산항( TDPA)화간분이알( MPD)위단체,이린분이갑산항( PA)위봉단제,채용2보법경저온용액축취합성료계렬결구신영적쌍동항형취선아알( TDPA-PI).채용FT-IR、WAXD、DSC화TGA측시대취합물적결구여성능진행료표정.고사료봉단제용량급아알화방법대동항형취선아알성능적영향. FT-IR표명,2충방법균능사TDPA-PAA아알화. DSC화TGA분석표명봉단제가재일정정도상제고PI적열성능,화학아알화득도적수지열성능우우열아알화. TDPA-PI속열소성취합물, Tg위280.6℃(고우Larc-I-TPI적259℃),구유교호적내열성화내용제성능.
A novel diketone anhydride poly( ether ketone ether)imides( TDPA-PI)was synthesized via the conven-tional two-step by using 4,4’-terephthaloyldiphthalic anhydride(TDPA)and m-Phenylenediamine(MPD). Polyim-ide acid( TDPA-PAA)was end capped with the excess TDPA or small amount of phthalic anhydride( PA)and took the research of the influence to the thermodynamic property. Research the two polyimide properties which prepared by thermal and chemical imidization. The structure and properties of TDPA-PI was characterized and measured by fourier transform infrared spectroscopy( FT-IR),wide-angle X-ray diffraction( WAXD),differential scanning calori-metric(DSC),thermal gravimetric analysis(TGA)and solubility tests. FT-IR tests show that the two imidization ways both can make TDPA-PAA form an imide ring structure. DSC and TGA show that end-cap can improve Ther-mal properties of TDPA-PI to some extent,and the chemical imidization is superior to thermal imidization. TDPA-PI,a Thermoplastic polyimide which Tg is 280. 6℃(above Larc-I-TPI 259℃)have good thermal and solvent prep-erties. LSS tests show that TDPA-PI has excellent adhesion properties.