CAJ | 학술논문

采用电沉积法在镍表面制备铜镍镀层，并将该铜镍镀层在不同温度下进行热处理。分别用扫描电镜法（SEM ）、能谱法（EDAX）和X衍射法（XRD）等对热处理后的铜镍镀层进行表征，研究热处理温度对铜镍镀层的光谱性能的影响。用电镀的方法获得的铜镍镀层表面是由节瘤组成，热处理温度在25～600℃范围，随着热处理温度的升高，铜镍镀层表面的节瘤变小；热处理温度在600～900℃范围，随着热处理温度的升高，铜镍镀层表面的节瘤变小，铜镍镀层表面的节瘤间的分界线越不明显。热处理温度在25～900℃范围，随着热处理温度的升高，铜镍镀层中铜的含量减小，从82.52 at％减小到78.30 at％；镍的含量增加，从17.48 at％增加到21.70 at％。铜镍镀层为Cu0.81 Ni0.19立方晶型结构，热处理温度在25～300℃范围，随着热处理温度的升高，Cu0.81 Ni0.19的晶型结构更完整；热处理温度在600～900℃范围，铜镍镀层中可能有部分的Cu0.81 Ni0.19立方晶型结构转变为Cu3.8 Ni立方晶型结构；随着热处理温度的升高，有利于Cu3.8 Ni（311）和Cu0.81 Ni0.19（311）晶面的生长。
채용전침적법재얼표면제비동얼도층，병장해동얼도층재불동온도하진행열처리。분별용소묘전경법（SEM ）、능보법（EDAX）화X연사법（XRD）등대열처리후적동얼도층진행표정，연구열처리온도대동얼도층적광보성능적영향。용전도적방법획득적동얼도층표면시유절류조성，열처리온도재25～600℃범위，수착열처리온도적승고，동얼도층표면적절류변소；열처리온도재600～900℃범위，수착열처리온도적승고，동얼도층표면적절류변소，동얼도층표면적절류간적분계선월불명현。열처리온도재25～900℃범위，수착열처리온도적승고，동얼도층중동적함량감소，종82.52 at％감소도78.30 at％；얼적함량증가，종17.48 at％증가도21.70 at％。동얼도층위Cu0.81 Ni0.19립방정형결구，열처리온도재25～300℃범위，수착열처리온도적승고，Cu0.81 Ni0.19적정형결구경완정；열처리온도재600～900℃범위，동얼도층중가능유부분적Cu0.81 Ni0.19립방정형결구전변위Cu3.8 Ni립방정형결구；수착열처리온도적승고，유리우Cu3.8 Ni（311）화Cu0.81 Ni0.19（311）정면적생장。
Cu‐Ni coatings were prepared on the surface of nickel by electrodeposition method ,and Cu‐Ni coat‐ings were heat‐treated in 25 ~ 900 ℃ .Heat‐treated Cu‐Ni coatings were characterized with scanning electron microscopy (SEM) ,energy dispersive x‐ray analysis (EDAX) and X‐ray diffraction (XRD) techniques ,re‐spectively .Effects of heat treatment temperature on the spectral properties of Cu‐Ni coatings were studied . The surface of Cu‐Ni coating is composed of the nodules .The nodules of Cu‐Ni coating surface become smaller with the increase in heat treatment temperature in 25 ~ 600 ℃ .The nodules of Cu‐Ni coating surface become smaller and the dividing line between the nodules becomes more blurred with the increase in heat treatment temperature in 600 ~ 900 ℃ .The contents of copper in Cu‐Ni coating decrease from 82 .52 at% to 78 .30 at%with the increase in heat treatment temperature in the range of 25 ~ 900 ℃ ;the contents of nickel in Cu‐Ni coating increase from 17 .48 at% to 21 .70 at% with the increase in heat treatment temperature in the range of 25 ~ 900 ℃ .The crystal structure of Cu‐Ni coating is Cu0 .81Ni0 .19 cubic crystal structure .The crystal structure of the Cu0 .81Ni0 .19 becomes more complete with the increase in heat treatment temperature in 25 ~300 ℃ .Part of crystal structure of the Cu0 .81Ni0 .19 can turn Cu0 .81Ni0 .19 cubic crystal structure into Cu3 .8Ni cubic crystal structure ,and is advantageous to Cu3 .8Ni (311) and Cu0 .81Ni0 .19 (311) growth with the increase in heat treatment temperature in 600 ~ 900 ℃ .