CAJ | 학술논문

工作环境温度过高或热量无法连续排出都会导致电子器件可靠性和运行效率降低，甚至失效，电子器件进行热防护是特殊场合应用电子系统的必要条件。本文综述电子器件常用的热防护方法，介绍喷射技术、相变材料、热电制冷等新型冷却技术，概述计算机模拟软件在热防护性能研究及优化方面的应用。最后针对核机器人热防护的特殊工况，提出防护建议。
공작배경온도과고혹열량무법련속배출도회도치전자기건가고성화운행효솔강저，심지실효，전자기건진행열방호시특수장합응용전자계통적필요조건。본문종술전자기건상용적열방호방법，개소분사기술、상변재료、열전제랭등신형냉각기술，개술계산궤모의연건재열방호성능연구급우화방면적응용。최후침대핵궤기인열방호적특수공황，제출방호건의。
The high ambient temperature and heat generated during operation can lead to the degradation of reliability and efficiency or failure of electronic devices.Thus,it is indispensable to keep cool of the electronic devices especially in some extreme situations.In this paper, the common methods used in thermal control are reviewed.Contemporary cooling technologies including spray techniques,phase change materials and thermoelectric cooling are introduced.The computer simulation software which is commonly applied on thermal performance studies and thermal control optimization are introduced.At last,suggestions on temperature control for electronic devices in nuclear robots are proposed due to their special working conditions.