模具工业
模具工業
모구공업
DIE & MOUID INDUSTRY
2015年
4期
11-15
,共5页
触点%冷镦模%数值模拟%厚度分布
觸點%冷鐓模%數值模擬%厚度分佈
촉점%랭대모%수치모의%후도분포
contact%cold heading die%numerical simulation%thickness distribution
针对继电器Ag-Cu复合触点冷镦成形后Ag层厚度分布不均的问题，通过有限元数值模拟分析了Ag-Cu复合触点预成形和终成形过程中等效应变的分布，Ag-Cu界面形状的变化规律及其影响因素，并通过改变上模半锥角α和Ag与上模、Cu与下模间摩擦因数的大小来改善Ag层厚度分布的均匀性。
針對繼電器Ag-Cu複閤觸點冷鐓成形後Ag層厚度分佈不均的問題，通過有限元數值模擬分析瞭Ag-Cu複閤觸點預成形和終成形過程中等效應變的分佈，Ag-Cu界麵形狀的變化規律及其影響因素，併通過改變上模半錐角α和Ag與上模、Cu與下模間摩抆因數的大小來改善Ag層厚度分佈的均勻性。
침대계전기Ag-Cu복합촉점랭대성형후Ag층후도분포불균적문제，통과유한원수치모의분석료Ag-Cu복합촉점예성형화종성형과정중등효응변적분포，Ag-Cu계면형상적변화규률급기영향인소，병통과개변상모반추각α화Ag여상모、Cu여하모간마찰인수적대소래개선Ag층후도분포적균균성。
In view of the uneven thickness distribution of the Ag layer after cold heading a relay with Ag-Cu composite contact, numerical simulation was used to analyze the distribu?tion of effective strain during the process of pre-forming and final forming, and the shape of Ag-Cu interface and its influencing factors were also considered. And then, some mea?sures to improve the thickness uniformity of Ag layer were proposed from the aspects of semi-taper angle of upper die and friction coefficients between Ag layer and upper die, Cu layer and lower die.
