电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2015年
5期
33-35,40
,共4页
多晶电阻%晶粒%淀积速率%四探针法测试电阻
多晶電阻%晶粒%澱積速率%四探針法測試電阻
다정전조%정립%정적속솔%사탐침법측시전조
polycrystalline silicon resistance%grain%deposition velocity%process control module
首先介绍了多晶电阻在线监控和工艺控制模块(PCM)监控的两种方法:四探针法和范德堡法,并解决了四探针法在线监控方法多晶电阻波动大的问题;针对生产过程中遇到的多晶电阻偏小问题,通过扫描电镜分析发现多晶晶粒明显偏大,通过对多晶淀积速率的分析确定多晶速率越小,多晶淀积晶粒越大,根据多晶导电理论可知多晶晶粒大,晶粒间界变小,晶粒间界杂质俘获变少,多晶掺杂浓度转化为载流子的比例变高,因此多晶电阻变小。最后根据工程实践列举了影响多晶淀积速率的两大主要因素为多晶淀积温度和多晶炉管维护次数,为保证多晶淀积速率稳定,多晶炉管维护次数尽量少于6次,同时需要对多晶淀积温度进行控制。
首先介紹瞭多晶電阻在線鑑控和工藝控製模塊(PCM)鑑控的兩種方法:四探針法和範德堡法,併解決瞭四探針法在線鑑控方法多晶電阻波動大的問題;針對生產過程中遇到的多晶電阻偏小問題,通過掃描電鏡分析髮現多晶晶粒明顯偏大,通過對多晶澱積速率的分析確定多晶速率越小,多晶澱積晶粒越大,根據多晶導電理論可知多晶晶粒大,晶粒間界變小,晶粒間界雜質俘穫變少,多晶摻雜濃度轉化為載流子的比例變高,因此多晶電阻變小。最後根據工程實踐列舉瞭影響多晶澱積速率的兩大主要因素為多晶澱積溫度和多晶爐管維護次數,為保證多晶澱積速率穩定,多晶爐管維護次數儘量少于6次,同時需要對多晶澱積溫度進行控製。
수선개소료다정전조재선감공화공예공제모괴(PCM)감공적량충방법:사탐침법화범덕보법,병해결료사탐침법재선감공방법다정전조파동대적문제;침대생산과정중우도적다정전조편소문제,통과소묘전경분석발현다정정립명현편대,통과대다정정적속솔적분석학정다정속솔월소,다정정적정립월대,근거다정도전이론가지다정정립대,정립간계변소,정립간계잡질부획변소,다정참잡농도전화위재류자적비례변고,인차다정전조변소。최후근거공정실천열거료영향다정정적속솔적량대주요인소위다정정적온도화다정로관유호차수,위보증다정정적속솔은정,다정로관유호차수진량소우6차,동시수요대다정정적온도진행공제。
The paper put forward and makes an overview for two method of testing polycrystalline silicon resistance: four probe method and van der pauw method, which were used in online test and PCM test individually, and then solve the problem of the big lfuctuation by four probe test. For production process in the encountered of poly resistance getting small, through the scan electric microscope analysis we found the bigger of crystal grain the smaller of the poly resistance. According to the polycrystalline silicon conductive theory, when the poly grain become lager, the grain boundaries which can capture carrier become smaller, polycrystalline doping concentration into the carrier ratio becomes higher, so the polycrystalline resistance small. According to the engineering practice we found the two leading factors for polycrystalline deposition rate is polycrystalline deposition rate temperature and furnace maintenance number, in order to ensure stable polycrystalline deposition rate, deposition temperature must be controlled and furnace maintenance should be less than 6 times.