CAJ | 학술논문

研究了含纳米0.1 wt.%Al颗粒SnAgCu无铅钎料Anand本构关系，将本构关系应用于有限元模拟，分析FCBGA器件SnAgCu-nano Al焊点的应力-应变响应。结果表明，在不同的温度和应变速率的条件下，可以采用非线性数据拟合方法得到SnAgCu-nano Al钎料的Anand本构方程的9个参数值。结合Anand本构模型，采用有限元法计算焊点应力-应变，发现FCBGA器件SnAgCu-nano Al焊点应力-应变分布和焊点阵列有明显的关系，最大的应力-应变集中于拐角焊点；SnAgCu-nano Al焊点的应力-应变值明显低于SnAgCu焊点，证明纳米Al可以提高SnAgCu焊点的可靠性。
연구료함납미0.1 wt.%Al과립SnAgCu무연천료Anand본구관계，장본구관계응용우유한원모의，분석FCBGA기건SnAgCu-nano Al한점적응력-응변향응。결과표명，재불동적온도화응변속솔적조건하，가이채용비선성수거의합방법득도SnAgCu-nano Al천료적Anand본구방정적9개삼수치。결합Anand본구모형，채용유한원법계산한점응력-응변，발현FCBGA기건SnAgCu-nano Al한점응력-응변분포화한점진렬유명현적관계，최대적응력-응변집중우괴각한점；SnAgCu-nano Al한점적응력-응변치명현저우SnAgCu한점，증명납미Al가이제고SnAgCu한점적가고성。
In this paper, the constitutive relation of SnAgCu-nano Al is investigated and the constitutive model is used in the finite element simulation to analyze the stress-strain response in FCBGA devices. The results show that the nine parameters of the Anand model can be fitted based on nonlinear data fitting method with different temperature and strain rate. Combining Anand model, the stress-strain response of solder joints is calculated by using the finite element method, and it is found that the distribution of stress-strain of solder joints in FCBGA device can be affected by the solder joints array, i.e., the maximum stress-strain concentrates in the concern solder joints. The results also demonstrate that the stress-strain of SnAgCu-nano Al solder joints is lower than that of SnAgCu solder joints, which implies that the addition of nano Al particles can enhance the reliability of SnAgCu solder joints.