电子测试
電子測試
전자측시
ELECTRONIC TEST
2015年
10期
38-39
,共2页
芯片%倒装封装技术%内部应力%检测
芯片%倒裝封裝技術%內部應力%檢測
심편%도장봉장기술%내부응력%검측
chip%flip chip packaging technology%internal stress%detection
当前,倒装芯片封装技术已经成为相关领域的主流方法,但由于芯片、基板、焊球、下填料等材料具有差异化的热膨胀系数,导致封装过程中极易引入热应力,不利于保持芯片的性能及其可靠性。采用有效方法能够对倒装封装过程中所产生的应力进行检测,对于完善封装参数,提高产品可靠性,具有重要的现实意义。
噹前,倒裝芯片封裝技術已經成為相關領域的主流方法,但由于芯片、基闆、銲毬、下填料等材料具有差異化的熱膨脹繫數,導緻封裝過程中極易引入熱應力,不利于保持芯片的性能及其可靠性。採用有效方法能夠對倒裝封裝過程中所產生的應力進行檢測,對于完善封裝參數,提高產品可靠性,具有重要的現實意義。
당전,도장심편봉장기술이경성위상관영역적주류방법,단유우심편、기판、한구、하전료등재료구유차이화적열팽창계수,도치봉장과정중겁역인입열응력,불리우보지심편적성능급기가고성。채용유효방법능구대도장봉장과정중소산생적응력진행검측,대우완선봉장삼수,제고산품가고성,구유중요적현실의의。
At present,flip chip packaging technology has become the mainstream method in related fields, but due to the chip,a substrate,solder ball, filler materials with different thermal expansion coefficient, resulting in the encapsulation process is very easy to introduce heat stress,is not conducive to maintaining the performance and reliability of the chip.The effective method can be used to detect the stress generated in the flip chip packaging process,and has important practical significance for improving the packaging parameters and improving the reliability of the product.