CAJ | 학술논문

采用敏化–活化两步法对云母粉进行预处理后再化学镀银。研究了镀液pH、银含量和云母粉与AgNO3质量比对镀银云母粉导电性的影响。通过红外光谱仪和X射线衍射仪表征了镀银云母粉的组织结构。通过表面形貌分析，研究了粗化预处理对云母粉化学镀银效果的影响。结果表明，粗化可提高粉体表面的粗糙度，使后续银镀层更致密。当AgNO3投加量为15 g/L，云母粉与AgNO3质量比为2.5∶1，pH为12时，银沉积率最高，镀银云母粉的表面形貌和导电性最好(体积电阻率约0.088?·cm)。化学镀银云母粉有望替代部分银粉作为导电填料，并在涂料或塑料等高分子材料中应用。
채용민화–활화량보법대운모분진행예처리후재화학도은。연구료도액pH、은함량화운모분여AgNO3질량비대도은운모분도전성적영향。통과홍외광보의화X사선연사의표정료도은운모분적조직결구。통과표면형모분석，연구료조화예처리대운모분화학도은효과적영향。결과표명，조화가제고분체표면적조조도，사후속은도층경치밀。당AgNO3투가량위15 g/L，운모분여AgNO3질량비위2.5∶1，pH위12시，은침적솔최고，도은운모분적표면형모화도전성최호(체적전조솔약0.088?·cm)。화학도은운모분유망체대부분은분작위도전전료，병재도료혹소료등고분자재료중응용。
Mica powder was subjected to electroless silver plating after pretreatment by a two-step method comprising sensitization and activation. The influences of pH, silver content, and mass ratio of mica powder to AgNO3 of plating bath on the conductivity of electroless silver plated mica powder were studied. The structure of electroless silver plated mica powder was characterized using infrared spectrometer and X-ray diffractometer. The effect of roughening pretreatment on electroless silver plating was studied by surface morphology analysis. The results showed that roughening improves the roughness of powder and increases the density of silver coating prepared thereon. Under the conditions of a dosage of AgNO3 15 g/L, a mass ratio of mica powder to AgNO3 2.5:1, and pH 12, the deposition rate of silver is the highest, and the electroless silver plated mica powder has the best surface morphology and lowest conductivity (volume resistivity 0.088 ?·cm). Electroless silver plated mica powder is a promising alternative to part of silver powder to serve as conductive filler and apply to coatings, plastics, and other high-molecular-weight polymer materials.