CAJ | 학술논문

伴随电子信息技术的爆炸性发展，微电子与固体电子技术发展也日新月异，从而促进了薄膜材料在不同领域的广泛应用。反之，高性能薄膜材料的出现也直接促进信息技术的飞跃。电子元器件的发展趋势呈现高速运行，微型与轻薄化，可靠性高，高度集成等趋势，同时与微电子工艺兼容。薄膜材料正好满足多层布线与高度集成等工艺要求。本文综合介绍功能薄膜的制备方法以及优缺点对比。同时也简要介绍了薄膜材料的种类，研究进展以及可能的用途。
반수전자신식기술적폭작성발전，미전자여고체전자기술발전야일신월이，종이촉진료박막재료재불동영역적엄범응용。반지，고성능박막재료적출현야직접촉진신식기술적비약。전자원기건적발전추세정현고속운행，미형여경박화，가고성고，고도집성등추세，동시여미전자공예겸용。박막재료정호만족다층포선여고도집성등공예요구。본문종합개소공능박막적제비방법이급우결점대비。동시야간요개소료박막재료적충류，연구진전이급가능적용도。
With the updating of electronics and information technology, microelectronics and solid state electronics have gotten high-speed development, thus contributing to the thin iflm materials widely used in different ifelds. The high-property thin iflms in turn directly promote the information technology’s soaring. The rapid integration and miniaturization of electronics demand that electronic products have the high-speed, micro-thin and highly reliable characteristics; meanwhile, they must be compatible with microelectronic technology. Thin iflm materials just meet the highly integrated multilayer wiring and other technical requirements. In this paper, the fabrication methods of thin iflm are introduced, their advantages and disadvantages compared. At the same time, the categories, latest research progress and application prospects of functional thin iflms are also introduced.