CAJ | 학술논문

采用碱性焦磷酸盐体系在45钢基体上电刷镀制备了铜锡合金镀层。考察了刷镀电压、刷镀液中氯化亚锡质量浓度、pH、刷镀时间等工艺参数对镀层的化学成分、物相结构、显微硬度和附着力的影响。结果表明：刷镀液pH为8.0~10.0时，随电压增大，镀层锡含量呈下降趋势。当氯化亚锡为9.0 g/L，pH为8.0~9.5时，刷镀液稳定，镀层主要由Cu20Sn6和Cu6Sn5构成，锡含量处于高锡水平(质量分数44.10%~57.40%)，显微硬度较高。当pH为9.5~10.0时，刷镀液不稳定，镀层主要由Cu20Sn6和α-Cu构成，锡含量处于中锡水平(质量分数35.60%~44.50%)，显微硬度较低。随刷镀时间延长，镀层的孔隙率显著下降，刷镀18 min所得镀层非常致密。刷镀电压为4 V时所得厚度为18.00~21.00μm的镀层的附着力在18~23 N之间。
채용감성초린산염체계재45강기체상전쇄도제비료동석합금도층。고찰료쇄도전압、쇄도액중록화아석질량농도、pH、쇄도시간등공예삼수대도층적화학성분、물상결구、현미경도화부착력적영향。결과표명：쇄도액pH위8.0~10.0시，수전압증대，도층석함량정하강추세。당록화아석위9.0 g/L，pH위8.0~9.5시，쇄도액은정，도층주요유Cu20Sn6화Cu6Sn5구성，석함량처우고석수평(질량분수44.10%~57.40%)，현미경도교고。당pH위9.5~10.0시，쇄도액불은정，도층주요유Cu20Sn6화α-Cu구성，석함량처우중석수평(질량분수35.60%~44.50%)，현미경도교저。수쇄도시간연장，도층적공극솔현저하강，쇄도18 min소득도층비상치밀。쇄도전압위4 V시소득후도위18.00~21.00μm적도층적부착력재18~23 N지간。
Copper–tin alloy deposits were prepared using electro-brush plating with alkaline pyrophosphate bath on 45 steel substrate. The effects of process parameters such as plating voltage, mass concentration of stannous chloride in bath, pH, and brush plating time on composition, phase structure, microhardness, and adhesion strength of the deposits were studied. The results showed that the tin content of the deposit decline with the increasing of plating voltage at bath pH 8.0-10.0. The bath containing stannous chloride 9.0 g/L is stable at pH 8.0-9.5 and produces the deposits mainly composed of Cu20Sn6 and Cu6Sn5 with a high tin content (44.10wt% to 57.40wt%) and high microhardness, while is unstable at pH 9.5-10.0 and produces the deposits mainly composed of Cu20Sn6 andα-Cu with a medium tin content (35.60wt% to 44.50wt%) and relatively low microhardness. The porosity of the deposit is decreased significantly with the extending of brush plating time. The deposit obtained by brush plating for 18 min is very compact. The adhesion strength of the deposits having a thickness of 18.00-21.00μm obtained at a brush voltage of 4 V is 18-23 N.