CAJ | 학술논문

以Na3AlF6-AlF3-MgF2-LiF为电解质，Al2O3、CuO为原料，对熔盐电解共沉积制备Al-Cu中间合金进行了研究，采用扫描电子显微镜（SEM）、能谱（EDS）及X射线衍射（XRD）分析合金表面形貌及元素分布.结果表明：施加外电压为2.6~3.5 V时，合金形成速率随电压的增加先增加后降低，施加外电压为3.3 V时，合金形成速率可达最大值；温度为895~955℃时，合金的形成速率随温度升高先增加后降低，温度为935℃时可达最大值；恒压3.3 V，温度为935℃，可制得Cu质量分数为11.51%、纯度为97.2%的Al-Cu合金，且合金中的铜与铝合金化过程中主要是以环状的Al2Cu相分布在晶界上；XRD分析表明合金中Cu主要是以Al2Cu相存在于合金组织中.
이Na3AlF6-AlF3-MgF2-LiF위전해질，Al2O3、CuO위원료，대용염전해공침적제비Al-Cu중간합금진행료연구，채용소묘전자현미경（SEM）、능보（EDS）급X사선연사（XRD）분석합금표면형모급원소분포.결과표명：시가외전압위2.6~3.5 V시，합금형성속솔수전압적증가선증가후강저，시가외전압위3.3 V시，합금형성속솔가체최대치；온도위895~955℃시，합금적형성속솔수온도승고선증가후강저，온도위935℃시가체최대치；항압3.3 V，온도위935℃，가제득Cu질량분수위11.51%、순도위97.2%적Al-Cu합금，차합금중적동여려합금화과정중주요시이배상적Al2Cu상분포재정계상；XRD분석표명합금중Cu주요시이Al2Cu상존재우합금조직중.
Using Na3AlF6-AlF3-MgF2-LiF as electrolyte and Al2O3,CuO as raw materials, Al -Cu intermediate alloy prepared by molten-salt electrolytic codeposition was studied. Alloy morphologies and elemental distributions were analyzed by SEM , EDS and XRD. The results show that the alloy formation rate increases first and then decreases at the applied outer voltage of 2.6~3.5 V with increasing voltage. Its rate reaches a maximum value at 3.3 V. With increasing temperature, the alloy formation rate increases first and then decreases at 895~955 ℃; the formation rate reaches the maximum value at 935 ℃. The mass fraction of Cu in the alloy is about 11.51 wt.%,with Al-Cu alloy purity of 97.2% at the constant voltage of 3.3 V at 935 ℃. Copper and aluminum alloys are distributed as ringed Al 2Cu phase along the gran boundaries during the alloying process. X-ray diffraction(XRD) analysis shows that Cu mainly exists in the form of Al2Cu phase.