电子与封装
電子與封裝
전자여봉장
EIECTRONICS AND PACKAGING
2015年
6期
9-12
,共4页
玻璃-金属封接%匹配封接%非匹配封接%过渡环封
玻璃-金屬封接%匹配封接%非匹配封接%過渡環封
파리-금속봉접%필배봉접%비필배봉접%과도배봉
electron technology%un-matched seal%insulation resistance%transition ring-seal
“14针密排”玻璃-金属封接件在生产及应用过程中常会出现玻璃炸裂,继而引起元件封接强度、气密性、热稳定性及耐冲压性等综合性能降低甚至报废。结合其特殊的导电性能和气密性设计要求,分析认为玻璃产生微裂纹的原因是封接元件膨胀系数不相匹配。利用“环封”工艺逐级过渡玻璃和金属之间的膨胀系数差异,同时结合玻璃抗压不抗拉的特性,达到“匹配封接”,彻底解决普遍存在于该类元器件中的致命问题。
“14針密排”玻璃-金屬封接件在生產及應用過程中常會齣現玻璃炸裂,繼而引起元件封接彊度、氣密性、熱穩定性及耐遲壓性等綜閤性能降低甚至報廢。結閤其特殊的導電性能和氣密性設計要求,分析認為玻璃產生微裂紋的原因是封接元件膨脹繫數不相匹配。利用“環封”工藝逐級過渡玻璃和金屬之間的膨脹繫數差異,同時結閤玻璃抗壓不抗拉的特性,達到“匹配封接”,徹底解決普遍存在于該類元器件中的緻命問題。
“14침밀배”파리-금속봉접건재생산급응용과정중상회출현파리작렬,계이인기원건봉접강도、기밀성、열은정성급내충압성등종합성능강저심지보폐。결합기특수적도전성능화기밀성설계요구,분석인위파리산생미렬문적원인시봉접원건팽창계수불상필배。이용“배봉”공예축급과도파리화금속지간적팽창계수차이,동시결합파리항압불항랍적특성,체도“필배봉접”,철저해결보편존재우해류원기건중적치명문제。
Cracks as the very bad defects always appear in the production and application of the 14-pin glass-to-metal seal, and for the result, the comprehensive performance such as sealing strength, air-tightness, thermal stability and stamping resistance will be reduced and even the element scrapped cause of it. Combining with its design requirements for special conductive and air-tightness performance, unmatched expansion coefficient have been regarded as the main reason causing micro cracks. Transition ring glass-to-metal technology have been used to reduce the expansion coefficient difference to get the matched glass-to-metal seal and solve such common problem in multi-pin glass-to-meal seal components in the paper.