CAJ | 학술논문

通过对断口形貌和界面微观组织的观察分析，研究了3种 Sn Bi／Cu 焊接接头的剪切断裂机理．结果表明：3种 Sn Bi／Cu 焊接接头均在弹性变形阶段断裂，并且均沿 Sn Bi 焊料／Cu 基板界面处断裂．孔洞降低了3种 Sn Bi／Cu 焊接接头的有效连接面积，从而降低了其剪切强度．根据3种 Sn Bi／Cu 焊接接头断口形貌，Sn59．9Bi40Cu 0．1／Cu 和Sn57．9Bi40Zn2Cu 0．1／Cu 焊接接头剪切断裂机制属于准解理、沿晶脆性断裂和韧窝的混合型断裂，而 Sn42Bi58／Cu 焊接接头剪切断裂机制属于准解理断裂．微观组织分析显示，3种焊料合金焊接接头界面处的金属间化合物层均为连续的 Cu6 Sn5相．
통과대단구형모화계면미관조직적관찰분석，연구료3충 Sn Bi／Cu 한접접두적전절단렬궤리．결과표명：3충 Sn Bi／Cu 한접접두균재탄성변형계단단렬，병차균연 Sn Bi 한료／Cu 기판계면처단렬．공동강저료3충 Sn Bi／Cu 한접접두적유효련접면적，종이강저료기전절강도．근거3충 Sn Bi／Cu 한접접두단구형모，Sn59．9Bi40Cu 0．1／Cu 화Sn57．9Bi40Zn2Cu 0．1／Cu 한접접두전절단렬궤제속우준해리、연정취성단렬화인와적혼합형단렬，이 Sn42Bi58／Cu 한접접두전절단렬궤제속우준해리단렬．미관조직분석현시，3충한료합금한접접두계면처적금속간화합물층균위련속적 Cu6 Sn5상．
The shear facture mechanism of Sn-Bi/Cu solder joints were studied by analyzing the fracture morphology and interfacial intermetallic compounds(IMCs).The result showed that all the three Sn-Bi/Cu solder joints almost ruptured at the elasticity deformation phase and the fractures occurred at the interface of Sn-Bi solder and Cu substrates.In addition,the shear strengths of the three Sn-Bi/Cu solder joints were decreased,since the real contact areas of the solder joints were reduced by the voids.According to the fracture morphology of the three Sn-Bi/Cu solder joints,the fracture mechanisms of Sn59.9Bi40Cu0.1/Cu and Sn57.9Bi40Zn2Cu0.1/Cu solder joints were the mixture of quasi-cleavage ,intergranular brittle and dimple,while the fracture mechanism of Sn42Bi58/Cu solder joint was quasi-cleavage.The microstructure analysis results showed that the IMCs of the three Sn-Bi/Cu solder joints were all continuous Cu6 Sn5 phase.