CAJ | 학술논문

建立了芯片尺寸封装焊点的柔性凸点三维有限元分析（FEA）模型，对该模型进行了热-结构耦合有限元分析，研究了热-结构耦合条件下柔性凸点温度场和应力应变的分布规律，对比了有无柔性层结构的凸点内应力应变的大小，分析了柔性层厚度、上下焊盘直径对柔性凸点应力应变的影响。结果表明：柔性层结构有效降低了凸点内的应力应变；随着柔性层厚度的增加，凸点内最大应力应变减小；随上焊盘和下焊盘直径的增加，凸点内最大应力应变的变化无明显规律。
건립료심편척촌봉장한점적유성철점삼유유한원분석（FEA）모형，대해모형진행료열-결구우합유한원분석，연구료열-결구우합조건하유성철점온도장화응력응변적분포규률，대비료유무유성층결구적철점내응력응변적대소，분석료유성층후도、상하한반직경대유성철점응력응변적영향。결과표명：유성층결구유효강저료철점내적응력응변；수착유성층후도적증가，철점내최대응력응변감소；수상한반화하한반직경적증가，철점내최대응력응변적변화무명현규률。
The 3D finite element analysis model of chip scale package solder joints with compliant layer was established, the thermal-structure coupling finite element analysis of the model was performed, the temperature field and stress and strain distribution of the solder joints with complaint layer were obtained under the condition of thermal-structure coupling, the stress and strain magnitude between the solder joints with complaint layer and the solder joints without complaint layer were compared, the influences of the thickness of compliant layers, the diameter thicknesses of up pad and down pad on the stress and strain of solder joints with compliant layer structure were studied. Results show that the compliant layer structure can reduce the stress and strain of solder joints effectively. With the increase thickness of compliant layer, the maximum stress and strain of the solder joints decrease. With the increase diameter of the up and down pad, the maximum stress and strain within the solder joints with complaint layer have no obvious regularity.