电子元件与材料
電子元件與材料
전자원건여재료
ELECTRONIC COMPONENTS & MATERIALS
2015年
7期
46-49
,共4页
张宝晖%谢泉%肖清泉%廖杨芳%杨云良
張寶暉%謝泉%肖清泉%廖楊芳%楊雲良
장보휘%사천%초청천%료양방%양운량
硅化镁/硅异质结%射频磁控溅射%溅射时间%X射线衍射%表面形貌%电阻率
硅化鎂/硅異質結%射頻磁控濺射%濺射時間%X射線衍射%錶麵形貌%電阻率
규화미/규이질결%사빈자공천사%천사시간%X사선연사%표면형모%전조솔
Mg2Si/Si heterojunction%RF-magnetron sputtering%sputtering time%X-ray diffraction%surface morphology%electrical resistivity
采用射频磁控溅射沉积并结合热处理制备Mg2Si/Si异质结,研究了溅射时间对Mg2Si/Si异质结的结构以及电阻率的影响。首先在P型Si衬底沉积不同厚度的Mg膜,然后进行低真空热处理,制备不同厚度的Mg 2 Si/Si异质结。通过XRD、SEM对Mg2Si/Si异质结中Mg2Si的晶体结构、异质结表面和剖面形貌进行分析,结果表明:制备了单一相Mg2Si薄膜,Mg2Si(220)衍射峰最强,异质结界面平整。通过四探针仪测量电阻率进行分析,发现电阻率随Mg 2 Si膜厚的增加而减小。
採用射頻磁控濺射沉積併結閤熱處理製備Mg2Si/Si異質結,研究瞭濺射時間對Mg2Si/Si異質結的結構以及電阻率的影響。首先在P型Si襯底沉積不同厚度的Mg膜,然後進行低真空熱處理,製備不同厚度的Mg 2 Si/Si異質結。通過XRD、SEM對Mg2Si/Si異質結中Mg2Si的晶體結構、異質結錶麵和剖麵形貌進行分析,結果錶明:製備瞭單一相Mg2Si薄膜,Mg2Si(220)衍射峰最彊,異質結界麵平整。通過四探針儀測量電阻率進行分析,髮現電阻率隨Mg 2 Si膜厚的增加而減小。
채용사빈자공천사침적병결합열처리제비Mg2Si/Si이질결,연구료천사시간대Mg2Si/Si이질결적결구이급전조솔적영향。수선재P형Si츤저침적불동후도적Mg막,연후진행저진공열처리,제비불동후도적Mg 2 Si/Si이질결。통과XRD、SEM대Mg2Si/Si이질결중Mg2Si적정체결구、이질결표면화부면형모진행분석,결과표명:제비료단일상Mg2Si박막,Mg2Si(220)연사봉최강,이질결계면평정。통과사탐침의측량전조솔진행분석,발현전조솔수Mg 2 Si막후적증가이감소。
Mg2Si/Si heterojunctions were prepared by RF-magnetron sputtering and heat treatment. The influences of sputtering time on the microstructures and the resistivity of the samples were investigated in detail. The different thickness of Mg films was deposited onto P-type Si substrates, and then low vacuum heat treatment was carried out. A series of Mg2Si/Si heterojunctions were prepared with different thicknesses. Crystal structure and cross-section of the prepared Mg2Si/Si heterojunctions were characterized by X-ray diffraction and scanning electron microscopy. The results show that single phase Mg2Si films are obtained, and Mg2Si (220) peak is the strongest. The interface of Mg2Si/Si heterojunction is smooth. Electrical resistivity is performed by four probe method. It decreases with the increase of the thickness of Mg2Si films.