CAJ | 학술논문

在低共熔溶剂中添加乙二胺四乙酸（EDTA）和氯化铵2种添加剂电沉积制备Zn?Ni合金镀层。研究添加剂对合金电沉积行为、成分、形貌和腐蚀性能的影响。循环伏安测试表明，EDTA的加入可以促进Zn进入Zn?Ni镀层中，而氯化铵起抑制Zn还原的作用。随着EDTA含量的增加，镀层中的Zn含量增加，但镀层的晶粒尺寸和电流效率降低。氯化铵浓度的增大能够有效地降低镀层的晶粒尺寸和 Zn 的含量，提高阴极电流效率。腐蚀实验表明，从含有氯化铵的镀液中得到的Zn?Ni镀层比从含有EDTA的镀液中得到的镀层具有更高的耐腐蚀性能。此外，添加剂的加入提高了镀层的耐腐蚀性能。
재저공용용제중첨가을이알사을산（EDTA）화록화안2충첨가제전침적제비Zn?Ni합금도층。연구첨가제대합금전침적행위、성분、형모화부식성능적영향。순배복안측시표명，EDTA적가입가이촉진Zn진입Zn?Ni도층중，이록화안기억제Zn환원적작용。수착EDTA함량적증가，도층중적Zn함량증가，단도층적정립척촌화전류효솔강저。록화안농도적증대능구유효지강저도층적정립척촌화 Zn 적함량，제고음겁전류효솔。부식실험표명，종함유록화안적도액중득도적Zn?Ni도층비종함유EDTA적도액중득도적도층구유경고적내부식성능。차외，첨가제적가입제고료도층적내부식성능。
Two additives of ethylene diamine tetraacetic acid (EDTA) and ammonium chloride (NH4Cl) were separately used in the electrodeposition of Zn?Ni alloy films from a deep eutectic solvent. The effects of these two additives on electrodeposition behavior, composition, morphology, and corrosion performance of the Zn?Ni alloys were investigated. The electrodeposition behaviors of Zn?Ni alloy revealed by the cyclic voltammetry show that the addition of EDTA to the Zn?Ni electrolyte enhances the Zn incorporation into the alloy film while the addition of NH4Cl produces an opposite effect by suppressing Zn incorporation into the film. With an increase of EDTA concentration in the electrolyte, the Zn content of the Zn?Ni films increases, while the grain size of the deposits and the current efficiency of the plating process decrease. The increase of NH4Cl concentration in the electrolyte would significantly refine the grain size of the electrodeposited Zn?Ni films, reduce the Zn content and increase the cathodic current efficiency. The corrosion testing indicates that the barrier corrosion resistances of Zn?Ni films electrodeposited from NH4Cl containing electrolytes are superior to those electrodeposited from EDTA-containing electrolytes, which in turn are superior to those electrodeposited from additive-free electrolytes.